参数资料
型号: G6ZU-1P-A DC12
厂商: Omron Electronics Inc-EMC Div
文件页数: 13/16页
文件大小: 0K
描述: RELAY RF SPDT 10MA 12V
标准包装: 50
系列: G6Z
继电器类型: RF
线圈类型: 锁存,单线圈
线圈电流: 16.7mA
线圈电压: 12VDC
触点形式: SPDT(1 C 型)
触点额定值(电流): 10mA
切换电压: 30VAC,30VDC - 最小值
关闭电压(最大): 9 VDC
特点: 密封式 - 全部
安装类型: 通孔
端接类型: PC 引脚
包装: 管件
触点材料: 铜(Cu),金(Au)
操作时间: 10ms
释放时间: 10ms
线圈功率: 200 mW
线圈电阻: 720 欧姆
工作温度: -40°C ~ 70°C
其它名称: G6Z 8121F
G6ZU-1P-ADC12
G6ZU1PA12DC
G6ZU1PADC12
Packaging
1. Tube Packaging
Relays in tube packaging are arranged so that the orientation mark
of each Relay in on the left side.
Reel Dimensions
33.5 ± 1
37.5 ± 1
Be sure not to make mistakes in Relay orientation when mounting
the Relay to the PCB.
Operation of Relays
A
2 ± 0.5
13 ± 0.2 dia.
21 ± 0.8 dia.
Stopper ( g ray)
Stopper ( g reen)
330
80
R1
Enlar g ed view of A
Tube length: 530 mm (stopper not included)
No. of Relays per tube: 25
2. Tape and Reel Packaging (Surface mount
Terminal Models)
Carrier Tape Dimensions
16 ± 0.1
4 ± 0.1
2 ± 0.1 1.5 + 0.1 dia.
1.75 ± 0.1
0.5 ± 0.05
10 ± 0.1
When ordering Relays in tape packing, add the prefix “-TR” to the
model number, otherwise the Relays in stick packing will be provided.
14.2 ± 0.1
Relays per Reel: 300
Direction of Relay Insertion
Pullin g direction
28.4 ± 0.1
32 ± 0.3
22.6 ± 0.1
20.6 ± 0.1
Top tape
Orientation mark
5 ° max.
10.2 ± 0.1
4 ± 0.1
A
0.2
1.5 + 0 0.1
1.7 + 0 0.15
5 ° max.
(cover tape)
Pullin g
direction
R0.75
Enlar g ed view of A
Note: The radius of the unmarked corner is 0.3 mm.
Carrier tape
Emboss
tape
Recommended Soldering Method
■ Temperature Conditions for IRS Method
When using reflow soldering, ensure that the Relay terminals and the
top of the case stay below the following curve. Check that these
conditions are actually satisfied before soldering the terminals.
Do not quench the terminals after mounting. Clean the Relay using
alcohol or water no hotter than 40 ° C max.
The thickness of cream solder to be applied should be between
150 and 200 μ m on OMRON’s recommended PCB pattern.
T4
Corre c t Soldering
In c orre c t Soldering
T3
Relay
T2
T1
PCB
Terminal
Solder
Land
Insufficient
amount of
solder
Excessive
amount of
solder
Check the soldering in the actual mounting conditions before use.
t 1
Preheatin g
t 2
Solderin g Time
Measured
part
Terminals
Top of case
Preheating
(T1 → T2, t1)
150 → 180 ° C,
120 s max.
---
Soldering
(T3, t2)
230 ° C min,
30 s max.
---
Maximum peak
(T4)
250 ° C max.
255 ° C max.
High-frequency Relay
G6Z
123
相关PDF资料
PDF描述
430111-01-0 TERM BARRIER 1CIRC SGL ROW .4375
430011-01-0 TERM BARRIER 1CIRC SGL ROW .4375
325343-02-0 TERM BARRIER 2CIRC SGL ROW .325
G6ZU-1FE-A DC9 RELAY RF SPDT 10MA 9V
325342-02-0 TERM BARRIER 2CIRC SGL ROW .325
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