参数资料
型号: G910TD2D
厂商: Global Mixed-mode Technology Inc.
英文描述: 122 x 32 pixel format, LED Backlight available
中文描述: 3.3 400mA/250mA低压差稳压器
文件页数: 2/9页
文件大小: 228K
代理商: G910TD2D
Ver: 6.6
Sep 25, 2002
TEL: 886-3-5788833
http://www.gmt.com.tw
2
G910/G911
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
(Note 1)
Input Voltage………………………………………….10V
Power Dissipation Internally Limited
(Note2)
Maximum Junction Temperature…………………150°C
Storage Temperature Range..……-65°C
≤ TJ ≤+150°C
Lead Temperature, Time for Wave Soldering
SOT89, SOT223, TO92 Package……..…...260°C, 4s
Continuous Power Dissipation (TA = + 25°C)
SOT 89
(1)………………………….…………………..0.5W
SOT 223
(1)……………………….……………………0.8W
TO 92 & TO 92
(1)…………….……………………..0.5W
Note (1): See Recommended Minimum Footprint.
Operating Conditions
(Note 1)
Input Voltage…………………………..…..………4V ~ 7V
Temperature Range………………….….0°C
≤ TJ ≤125°C
Electrical Characteristics
VIN =5V, IO = 400mA/250mA+, CIN=10F, COUT =10F. All specifications apply for TA = TJ = 25°C.[Note 3]
PARAMETER
CONDITIONS
MIN
TYP
MAX UNITS
5mA < IO <400mA
Output Voltage
5mA < IO <250mA
+
3.234
3.3
3.366
V
Line Regulation
4V < VIN < 7V, IO = 10mA
10
30
mV
10mA < IO < 400mA
42
60
Load Regulation
10mA < IO <250mA
+
28
45
mV
Output Impedance
100mA DC and 100mA AC, fO = 120Hz
102
m
Quiescent Current
VIN = 5V
0.6
mA
Ripple Rejection
fi = 120 Hz, 1VP-P, Io = 100mA
42
dB
IO = 400mA
0.65
IO =250mA
+
0.35
V
Dropout Voltage
IO = 50mA
50
100
mV
VIN = 4.5V, mounted on SOT 89 rec-
ommended minimum footprint
400
Output Current
Continuous Test
TA = 25°C, TJ < 125°C,
VOUT within ±2% (Note 2) VIN = 5.2V, TO 92 & TO 92 package
0.53 inch leads soldered to PC Board
250+
mA
Short Circuit Current
0.77
A
Over Temperature
125
°C
[
+ for TO-92 & TO-92 Package]
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are
conditions under which the device functions but the specifications might not be guaranteed. For guaranteed speci-
fications and test conditions see the Electrical Characteristics.
Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resis-
tance,
θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is
Tjmax-TA /
θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal
shutdown. For the G910 in SOT 89 package & TO 92,TO 92,
θJA is 250°C/W and in the SOT-223 package is
156°C/W (See Recommended Minimum Footprint). The safe operation in SOT 89,TO 92,TO 92 & SOT 223
package, it can see “Typical Performance Characteristics” (Safe Operating Area).
Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Note4: The type of output capacitor should be tantalum or aluminum.
Definitions
Dropout Voltage
The input/output Voltage differential at which the regu-
lator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100mV below its nominal value, dropout
voltage is affected by junction temperature, load cur-
rent and minimum input supply requirements.
Line Regulation
The change in output voltage for a change in input volt-
age. The measurement is made under conditions of low
dissipation or by using pulse techniques such that av-
erage chip temperature is not significantly affected.
Load Regulation
The change in output voltage for a change in load
current at constant chip temperature. The measure-
ment is made under conditions of low dissipation or by
using pulse techniques such that average chip tem-
perature is not significantly affected.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.
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