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参数资料
| 型号： | GM-205810-000 |
| 厂商： | DeLorme |
| 文件页数： | 18/18页 |
| 文件大小： | 0K |
| 描述： | MODULE GPS RCVR GPS2058 |
| 产品目录绘图： | GM-205810-000 |
| 标准包装： | 1 |
| 频率： | 1575.42MHz |
| 数据传输率 - 最大： | 57.6 kbps |
| 调制或协议： | GPS |
| 应用： | GPS 接收器 |
| 电流 - 接收： | 50mA |
| 数据接口： | PCB，表面贴装 |
| 存储容量： | 16kB 闪存 |
| 天线连接器： | PCB，表面贴装 |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 40 引脚 |
| 包装： | 剪切带 (CT) |
| 其它名称： | GM-205810-000CT |
Recommended Reflow Profile
The following graph shows a suggested reflow profile for an automated surface mount assembly processes. This reflow profile
follows the recommendations for the lead-free solder used in the module assembly. The reflow process follows 4 complete
stages:
Pre-heat: Ramp to 130°C at a rate of 2°C/second
Soak: Ramp from 130 to 165°C over 60-150 seconds
Reflow: Ramp from 165°C to 217°C at a rate of 2°C/second. The peak reflow temperature should be 230-250°C, total time
above 217°C should be less than 45 seconds
Cool-down: A cooling rate of 3°C/second is recommended
Ideally the module will only be subjected to a single reflow process with the module on the top side surface of the printed circuit
board. Additional reflows may cause bridging between pads, or potential damage to the module.
If the PCB is a two-sided board the secondary reflow should be performed with the module on the top side of the board to avoid
damage to the module. If a secondary reflow is performed with the module on the bottom side of the printed circuit board the
weight of the shield can or entire module may exceed the adhesive properties of the solder menisci and the shield can or the
entire module may fall off the board.
Page 18
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相关代理商/技术参数 |
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| GM-2058EV-101 | 功能描述:KIT EVAL GPS RCVR GPS2058-10 RoHS:是 类别:RF/IF 和 RFID >> RF 评估和开发套件，板 系列:- 标准包装:1 系列:- 类型:GPS 接收器 频率:1575MHz 适用于相关产品:- 已供物品:模块 其它名称:SER3796 |
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| GM2110 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:XGA/SXGA LCD Controller |
| GM2113 | 制造商:GTM 制造商全称:GTM 功能描述:CMOS POSITIVE VOLTAGE REGULATOR |
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