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| 型号： | GM5BW96320A |
| 厂商： | Sharp Microelectronics |
| 文件页数： | 12/14页 |
| 文件大小： | 707K |
| 描述： | LED PSUEDO WHITE 3.2X2.8 SMD |
| 产品变化通告： | GM4, GM5 Discontinuation 14/Oct/2011 |
| 产品目录绘图： | LED PLCC-2 Side LED PLCC-2 Top 1-LED Schematic |
| 特色产品： | GM5BW96320A and GM5BW96380A |
| 标准包装： | 1 |
| 颜色： | 冷白色 |
| Millicandela 等级： | 1400mcd |
| 正向电压： | 3.3V |
| 电流 - 测试： | 20mA |
| 波长 - 主： | 6900K |
| 视角： | 120° |
| 透镜类型： | 透明，有色 |
| 透镜样式/尺寸： | 圆形，带平顶，2.4mm |
| 封装/外壳： | 2-PLCC |
| 尺寸/尺寸： | 3.20mm L x 2.80mm W |
| 高度： | 1.90mm |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 其它名称： | 425-2652-6 |
Sheet No.: DG-06Y004A
12
GM5BW96320A
?SPAN class="pst GM5BW96320A_2653400_2">Soldering Instructions
1. When soldering with reflow methods, Sharp recommends following the soldering profile in Fig. 15.
2. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
3. When using a second reflow, the second process should be carried out as soon as possible after the first.
4. Electrodes on this part are silver-plated. If the part is exposed to a corrosive environment, the plating may be
damaged, thereby affecting solderability.
5. The Reflow Profile shown in Fig. 15 should be considered as a set of maximum parameters. Since this part uses
the leads for heatsinking, the peak temperature should be kept as cool as possible and the cooldown period
lengthened as much as possible. Thermal conduction into the LED will be affected by the performance of the
reflow process, so verification of the reflow process is recommended. These parts may be used in a nitrogen
reflow process.
?SPAN class="pst GM5BW96320A_2653400_2">Recommended Solder Pad Design
1. Solderability depends on reflow conditions, solder paste, and circuit board materials. Check the entire process
before production commences.
2. Fig. 16 shows the recommended solder pattern for this part.
3. When using backside dip methods, Sharp recommends checking the process carefully: board warping from heat
can cause mechanical failure in these parts, in addition to the high heat conducted into the part through the
leads. Performing reflow after dip is recommended, with the interval between the two as short as possible.
Fig. 15 Temperature Profile
Fig. 16 Recommended Solder Pad Design
25
150
1 ~ 4癈/s
1 ~ 4癈/s
1 ~ 2.5癈/s
220
260 (MAX)
200
60 ~ 120s
5s (MAX)
60s (MAX)
TE: ni:mm
Product center
1.5
1.5
4.5
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| GM5BW96370A | 功能描述:标准LED-SMD Psuedo White 2.0 cd 2.8 x 3.5mm 2K mcd RoHS:否 制造商:Vishay Semiconductors 封装 / 箱体:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明颜色:Red 波长/色温:631 nm 透镜颜色/类型:Water Clear 正向电流:30 mA 正向电压:2 V 光强度:54 mcd 显示角:130 deg 系列:VLMx1500 封装:Reel |
| GM5BW96371A | 功能描述:标准LED-SMD Pseudo White LED 2.0 cd 3.2x2.8mm RoHS:否 制造商:Vishay Semiconductors 封装 / 箱体:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明颜色:Red 波长/色温:631 nm 透镜颜色/类型:Water Clear 正向电流:30 mA 正向电压:2 V 光强度:54 mcd 显示角:130 deg 系列:VLMx1500 封装:Reel |
| GM5BW96380A | 功能描述:标准LED-SMD Pseudo White LED 2.5 cd 3.2x2.8mm RoHS:否 制造商:Vishay Semiconductors 封装 / 箱体:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明颜色:Red 波长/色温:631 nm 透镜颜色/类型:Water Clear 正向电流:30 mA 正向电压:2 V 光强度:54 mcd 显示角:130 deg 系列:VLMx1500 封装:Reel |
| GM5BW96381A | 功能描述:LED WHT 20MA 3.5V 4-PLCC RoHS:是 类别:光电元件 >> LED - Millicandela 等级:2260mcd 正向电压:2.1V 电流 - 测试:20mA 波长 - 主:590nm 波长 - 峰值:- 视角:- 透镜类型:散射，有色 透镜样式/尺寸:圆顶椭圆，5.1mm x 3.7mm 封装/外壳:径向 尺寸/尺寸:- 高度:7.00mm 安装类型:通孔 包装:散装 在特定电流下的光通量 - 测试:- |
| GM5BW96385A | 功能描述:标准LED-SMD White 5000K 20mA 3.5V RoHS:否 制造商:Vishay Semiconductors 封装 / 箱体:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明颜色:Red 波长/色温:631 nm 透镜颜色/类型:Water Clear 正向电流:30 mA 正向电压:2 V 光强度:54 mcd 显示角:130 deg 系列:VLMx1500 封装:Reel |
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