参数资料
型号: GM5BW97332A
厂商: Sharp Microelectronics
文件页数: 13/15页
文件大小: 969K
描述: LED WHITE 6700K 20MA 3.2V PLCC4
产品目录绘图: LED PLCC-2 Side
LED PLCC-2 Top
3-LED Schematic
标准包装: 1
颜色: 冷白色
Millicandela 等级: 5800mcd
正向电压: 3.2V
电流 - 测试: 20mA
波长 - 主: 6700K
透镜类型: 散射,白色
透镜样式/尺寸: 圆形,带平顶,2.4mm
封装/外壳: 4-PLCC
尺寸/尺寸: 3.20mm L x 2.80mm W
高度: 1.90mm
安装类型: 表面贴装
包装: 标准包装
在特定电流下的光通量 - 测试: 15 lm
产品目录页面: 2920 (CN2011-ZH PDF)
其它名称: 425-2742-6
 
Sheet No.: DG-089015B
13
Preliminary
GM5BW9733xA (Series)
?SPAN class="pst GM5BW97333A_2656847_3">Soldering Instructions
1. When soldering with reflow methods, Sharp recommends following the soldering profile in Fig. 18.
2. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
3. When using a second reflow, the second process should be carried out as soon as possible after the first.
4. Electrodes on this part are silver-plated. If the part is exposed to a corrosive environment, the plating may be
damaged, thereby affecting solderability.
5. The Reflow Profile shown in Fig. 18 should be considered as a set of maximum parameters. Since this part uses
the leads for heatsinking, the peak temperature should be kept as cool as possible and the cooldown period
lengthened as much as possible. Thermal conduction into the LED will be affected by the performance of the
reflow process, so verification of the reflow process is recommended. These parts may be used in a nitrogen
reflow process.
Fig. 18 Temperature Profile
25
150
1 ~ 4癈/s
1 ~ 4癈/s
1 ~ 2.5癈/s
220
260 (MAX)
Time (s)
200
60 ~ 120s
5s (MAX)
60s (MAX)
-
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