参数资料
型号: GM72V66841ELT-7
厂商: HYNIX SEMICONDUCTOR INC
元件分类: DRAM
英文描述: 2,097,152 WORD x 8 BIT x 4 BANK SYNCHRONOUS DYNAMIC RAM
中文描述: 8M X 8 SYNCHRONOUS DRAM, 5.4 ns, PDSO54
封装: 0.400 INCH, TSOP2-54
文件页数: 6/57页
文件大小: 592K
代理商: GM72V66841ELT-7
LG Semicon
GM72V66841CT/CLT
Burst stop in full page [BST] :
This
command stops a full-page burst operation (burst
length
=
full-page(512;GM72V66841CT/CLT)
and is illegal otherwise. Full page burst continues
until this command is input. When data
input/output is completed for full-page of data, it
automatically returns to the start address, and
input/output is performed repeatedly.
Column address strobe and read command
[READ]:
This command starts a read operation.
In addition, the start address of burst read is
determined by the column address
AY0 to AY8; GM72V66841CT/CLT) and the
bank select address (A12/A13). After the read
operation, the output buffer becomes High-Z.
Read with auto-Precharge [READ A]:
This
command
automatically performs a Precharge
operation after a burst read with a burst length of
1, 2, 4 or 8. When the burst length is full-page,
this command is illegal.
Column address strobe and write command
[WRIT]:
This command starts a write operation.
When the burst write mode is selected, the column
address (AY0 to AY8; GM72V66841CT/CLT)
and the bank select address (A12/A13) become the
burst write start address. When the single write
mode is selected, data is only written to the
location specified by the column address (AY0 to
AY8;GM72V66841CT/CLT) and the bank select
address (A12/A13).
Write with auto-Precharge [WRIT A]:
This
command automatically performs a Precharge
operation after a burst write with a length of 1, 2,
4 or 8, or after a single write operation. When the
burst length is full-page, this command is illegal.
Row address strobe and bank activate
[ACTV]:
This command activates the bank that
is selected by A12/A13(BS) and determines the
row address (AX0 to AX11). If A12 is Low and
if A13 is Low, bank 0 is activated. If A12 is High
and A13 is Low, bank 1 is activated. If A12 is
Low and A13 is High, bank 2 is activated. If A12
is High and A13 is High, bank 3 is activated.
Precharge selected bank [PRE]:
This
command starts Precharge operation for the bank
selected by A12/A13. If A12 is Low and if A13 is
Low, bank 0 is selected. If A12 is High and A13
is Low, bank 1 is selected. If A12 is Low and
A13 is High, bank 2 is selected. If A12 is High
and A13 is High, bank 3 is selected.
Precharge all banks [PALL]:
This command
starts a Precharge operation for all banks.
Refresh [REF/SELF]:
This command starts the
refresh operation. There are two types of refresh
operation, the one is auto-refresh, and the other is
self-refresh. For details, refer to the CKE truth
table section.
Mode register set [MRS]:
Synchronous DRAM
has a mode register that defines how it operates.
The mode register is specified by the address pins
(A0 to A11) at the mode register set cycle. For
details, refer to the mode register configuration.
After Power on, the contents of the mode register
are undefined, execute the mode register set
command to set up the mode register.
5
Ignore command [DESL]:
When this command
is set (CS is High), the synchronous DRAM
ignores command input at the Clock. However,
the internal status is held.
No operation [NOP]:
This command is not an
execution
command.
However,
operations continue.
the
internal
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参数描述
GM72V66841ELT-75 制造商:HYNIX 制造商全称:Hynix Semiconductor 功能描述:2,097,152 WORD x 8 BIT x 4 BANK SYNCHRONOUS DYNAMIC RAM
GM72V66841ELT-7J 制造商:HYNIX 制造商全称:Hynix Semiconductor 功能描述:2,097,152 WORD x 8 BIT x 4 BANK SYNCHRONOUS DYNAMIC RAM
GM72V66841ELT-7K 制造商:HYNIX 制造商全称:Hynix Semiconductor 功能描述:2,097,152 WORD x 8 BIT x 4 BANK SYNCHRONOUS DYNAMIC RAM
GM72V66841ELT-8 制造商:HYNIX 制造商全称:Hynix Semiconductor 功能描述:2,097,152 WORD x 8 BIT x 4 BANK SYNCHRONOUS DYNAMIC RAM
GM72V66841ET 制造商:HYNIX 制造商全称:Hynix Semiconductor 功能描述:2,097,152 WORD x 8 BIT x 4 BANK SYNCHRONOUS DYNAMIC RAM