参数资料
型号: GMK107BJ333KA-T
厂商: Taiyo Yuden
文件页数: 14/28页
文件大小: 0K
描述: CAP CER 0.033UF 35V 10% X5R 0603
产品变化通告: X5R, X7R Part Number Change
标准包装: 4,000
系列: M
电容: 0.033µF
电压 - 额定: 35V
容差: ±10%
温度系数: X5R
安装类型: 表面贴装,MLCC
工作温度: -55°C ~ 85°C
应用: 通用
封装/外壳: 0603(1608 公制)
尺寸/尺寸: 0.063" L x 0.031" W(1.60mm x 0.80mm)
厚度(最大): 0.035"(0.90mm)
包装: 带卷 (TR)
Multilayer Ceramic Capacitors
■ PACKAGING
①Minimum Quantity
● Taped package
Type(EIA)
mm
Thickness
code
Standard quantity [pcs]
Paper tape Embossed tape
□MK042(01005)
□VS042(01005)
□MK063(0201)
□WK105(0204) ※
□MK105(0402)
□VK105(0402) ※
□MK107(0603)
□WK107(0306) ※
□MR107(0603)
□MK212(0805)
□WK212(0508) ※
□MR212(0805)
□MK316(1206)
□MR316(1206)
0.2
0.2
0.3
0.3
0.2
0.3
0.5
0.5
0.45
0.5
0.8
0.45
0.85
125
0.85
1.15
125
1.6
C, D
C
P, T
P
C
P
V
W
K
V
A
K
D
G
D
F
G
L
15000
10000
20000
15000
10000
4000
4000
4000
40000
4000
3000
3000
2000
0.85
D
□MK325(1210)
□MR325(1210)
□MK432(1812)
1.15
1.9
2.0max.
2.5
2.5
F
N
Y
M
M
2000
500(T), 1000(P)
500
Note : ※ LW Reverse type.
②Taping material
※No bottom tape for pressed carrier tape
● Card board carrier tape
Top tape
Base tape
Sprocket hole
● Embossed tape
Top tape
Sprocket hole
Bottom tape
Chip cavity
Base tape
Chip cavity
Chip filled
Chip
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E02R01
相关PDF资料
PDF描述
T491C106K016AH CAP TANT 10UF 16V 10% 2312
GMK107BJ473KA-T CAP CER 0.047UF 35V 10% X5R 0603
VE-27P-CY-F2 CONVERTER MOD DC/DC 13.8V 50W
MAX6626PMTT+T IC TEMP SENSOR I2C 6-TDFN
GSA49DTMN CONN EDGECARD 98POS R/A .125 SLD
相关代理商/技术参数
参数描述
GMK107BJ333MA-T 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP MLCC 0603 35V X5R 0.033uF 20% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
GMK107BJ473KAHT 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP MLCC 0603 35V X5R0.047uF 10% TOL RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
GMK107BJ473KA-T 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP MLCC 0603 35V X5R 0.047uF 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
GMK107BJ473MA-T 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP MLCC 0603 35V X5R 0.047uF 20% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
GMK212AB7105KA-T 制造商:TAIYO-YUDEN 制造商全称:Taiyo Yuden (U.S.A.), Inc 功能描述:Notice for TAIYO YUDEN products