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参数资料
| 型号： | GP2W1002YP0F |
| 厂商： | Sharp Microelectronics |
| 文件页数： | 10/14页 |
| 文件大小： | 373K |
| 描述： | IRDA MODULE 1152KBPS 8SMD |
| 标准包装： | 2,000 |
| 系列： | * |
| 数据速率： | 1.152Mbs（MIR） |
| 电源电压： | 2.7 V ~ 5.5 V |
| 无效电流，标准值@ 25° C： | 0.01µA |
| 通信距离，低功率： | 20cm，1m |
| 方向： | 侧视图 |
| 工作温度： | -25°C ~ 85°C |
| 尺寸： | 8mm x 3mm x 2.5mm |
| 标准： | IrPHY 1.4 |
| 关机： | * |
| 包装： | 带卷 (TR) |
GP2W1002YP0F
1. In case of solder reflow
2. Other precautions
3. Hand soldering
MAX120s
MAX70s
MAX10s
?SPAN class="pst GP2W1002YP0F_2589044_0">Soldering Method
1 to 5/s
1 to 5/s
Please carry out only two times soldering at the temperature and the time within the temperature profile as shown
in the figure below. Reflow interval shall be within 3 days under conditions, 10 to 30, 70%RH or less.
An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin.
So keep the package temperature within that specified in Item 1. Also avoid immersing the resin part in the solder.
Even if within the temperature profile above, there is the possibility that the gold wire in package is broken
in case that the deformation of PCB gives the affection to lead pins. Please use after confirming the conditions fully
by actual solder reflow machine.
鸖oldering iron shall be less than 25W, and temperature of point of soldering iron shall use at 300or less.
鸖oldering time shall be within 5s.
鸖oldered product shall treat at normal temperature.
200
MAX
165
25
MAX
260
Sheet No.: E3-A00201EN
10
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