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参数资料
| 型号： | GS88218BD-200V |
| 厂商： | GSI TECHNOLOGY |
| 元件分类： | SRAM |
| 英文描述： | 512K X 18 CACHE SRAM, 6.5 ns, PBGA165 |
| 封装： | 13 X 15 MM, 1 MM PITCH, FPBGA-165 |
| 文件页数： | 1/35页 |
| 文件大小： | 1164K |
| 代理商： | GS88218BD-200V |
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GS88218/36B(B/D)-xxxV
512K x 18, 256K x 36
9Mb SCD/DCD Sync Burst SRAMs
250 MHz–150 MHz
1.8 V or 2.5 V VDD
1.8 V or 2.5 V I/O
119- and 165-Bump BGA
Commercial Temp
Industrial Temp
Rev: 1.04 6/2007
1/35
2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Features
FT pin for user-configurable flow through or pipeline operation
Single/Dual Cycle Deselect selectable
IEEE 1149.1 JTAG-compatible Boundary Scan
On-chip read parity checking; even or odd selectable
ZQ mode pin for user-selectable high/low output drive
1.8 V or 2.5 V core power supply
1.8 V or 2.5 V I/O supply
LBO pin for Linear or Interleaved Burst mode
Internal input resistors on mode pins allow floating mode pins
Default to SCD x18/x36 Interleaved Pipeline mode
Byte Write (BW) and/or Global Write (GW) operation
Internal self-timed write cycle
Automatic power-down for portable applications
JEDEC-standard 119- and 165-bump BGA packages
RoHS-compliant packages available
Functional Description
Applications
The GS88218/36B(B/D)-xxxV is a 9,437,184-bit high
performance synchronous SRAM with a 2-bit burst address
counter. Although of a type originally developed for Level 2
Cache applications supporting high performance CPUs, the device
now finds application in synchronous SRAM applications, ranging
from DSP main store to networking chip set support.
Controls
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV), and write control inputs (Bx, BW,
GW) are synchronous and are controlled by a positive-edge-
triggered clock input (CK). Output enable (G) and power down
control (ZZ) are asynchronous inputs. Burst cycles can be initiated
with either ADSP or ADSC inputs. In Burst mode, subsequent
burst addresses are generated internally and are controlled by
ADV. The burst address counter may be configured to count in
either linear or interleave order with the Linear Burst Order (LBO)
input. The Burst function need not be used. New addresses can be
loaded on every cycle with no degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by the
user via the FT mode . Holding the FT mode pin low places the
RAM in Flow Through mode, causing output data to bypass the
Data Output Register. Holding FT high places the RAM in
Pipeline mode, activating the rising-edge-triggered Data Output
Register.
SCD and DCD Pipelined Reads
The GS88218/36B(B/D)-xxxV is a SCD (Single Cycle
Deselect) and DCD (Dual Cycle Deselect) pipelined
synchronous SRAM. DCD SRAMs pipeline disable commands
to the same degree as read commands. SCD SRAMs pipeline
deselect commands one stage less than read commands. SCD
RAMs begin turning off their outputs immediately after the
deselect command has been captured in the input registers.
DCD RAMs hold the deselect command for one full cycle and
then begin turning off their outputs just after the second rising
edge of clock. The user may configure this SRAM for either
mode of operation using the SCD mode input.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
FLXDrive
The ZQ pin allows selection between high drive strength (ZQ
low) for multi-drop bus applications and normal drive strength
(ZQ floating or high) point-to-point applications. See the
Output Driver Characteristics chart for details.
Sleep Mode
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Core and Interface Voltages
The GS88218/36B(B/D)-xxxV operates on a 1.8 V or 2.5 V
power supply. All input are 2.5 V and 1.8 V compatible.
Separate output power (VDDQ) pins are used to decouple
output noise from the internal circuits and are 2.5 V and 1.8 V
compatible.
Paramter Synopsis
-250
-200
-150
Unit
Pipeline
3-1-1-1
tKQ
tCycle
3.0
4.0
3.0
5.0
3.8
6.7
ns
Curr (x18)
Curr (x32/x36)
200
230
170
195
140
160
mA
Flow Through
2-1-1-1
tKQ
tCycle
5.5
6.5
7.5
ns
Curr (x18)
Curr (x32/x36)
160
185
140
160
128
145
mA
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PDF描述 |
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| GSCC01A1B-Q01 | SNAP ACTING/LIMIT SWITCH, SPDT, MOMENTARY, 0.55A, 125VDC, 53.5mm, PANEL MOUNT |
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| GLCB03A1B5Q04 | SNAP ACTING/LIMIT SWITCH, SPDT, MOMENTARY, 0.55A, 125VDC, PANEL MOUNT |
相关代理商/技术参数 |
参数描述 |
|---|---|
| GS88218CB-200 | 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 2.5V/3.3V 9MBIT 512KX18 6.5NS/3NS 119FPBGA - Trays |
| GS88218CB-200I | 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 2.5V/3.3V 9MBIT 512KX18 6.5NS/3NS 119FPBGA - Trays |
| GS88218CB-200IV | 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 1.8V/2.5V 9MBIT 512KX18 6.5NS/3NS 119FPBGA - Trays |
| GS88218CB-200V | 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 1.8V/2.5V 9MBIT 512KX18 6.5NS/3NS 119FPBGA - Trays |
| GS88218CB-250 | 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 2.5V/3.3V 9MBIT 512KX18 5.5NS/2.5NS 119FPBGA - Trays |
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