参数资料
| 型号： | HA4P5002-5Z |
| 厂商： | Intersil |
| 文件页数： | 4/12页 |
| 文件大小： | 0K |
| 描述： | IC BUFFER 110MHZ HIGH OUT 20PLCC |
| 标准包装： | 46 |
| 放大器类型： | 缓冲器 |
| 电路数： | 1 |
| 转换速率： | 1300 V/µs |
| -3db带宽： | 110MHz |
| 电流 - 输入偏压： | 2µA |
| 电压 - 输入偏移： | 5000µV |
| 电流 - 电源： | 8.3mA |
| 电流 - 输出 / 通道： | 220mA |
| 电压 - 电源，单路/双路(±)： | 10 V ~ 40 V，±5 V ~ 20 V |
| 工作温度： | 0°C ~ 75°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-LCC（J 形引线） |
| 供应商设备封装： | 20-PLCC |
| 包装： | 管件 |
12
FN2921.12
October 18, 2013
HA-5002
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
TOP VIEW
INDEX
AREA
12
3
-C-
SEATING PLANE
x 45°
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
SIDE VIEW “A
SIDE VIEW “B”
1.27 (0.050)
6.20 (0.244)
5.80 (0.228)
4.00 (0.157)
3.80 (0.150)
0.50 (0.20)
0.25 (0.01)
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
0.25(0.010)
0.10(0.004)
0.51(0.020)
0.33(0.013)
8°
0°
0.25 (0.010)
0.19 (0.008)
1.27 (0.050)
0.40 (0.016)
1.27 (0.050)
5.20(0.205)
1
2
3
4
5
6
7
8
TYPICAL RECOMMENDED LAND PATTERN
2.20 (0.087)
0.60 (0.023)
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