参数资料
型号: HA5024IBZ
厂商: Intersil
文件页数: 8/16页
文件大小: 0K
描述: IC OPAMP QUAD 125MHZ 20-SOIC
标准包装: 38
应用: 电流反馈
电路数: 4
-3db带宽: 125MHz
转换速率: 350 V/µs
电流 - 电源: 7.5mA
电流 - 输出 / 通道: 20mA
电压 - 电源,单路/双路(±): ±4.5 V ~ 18 V
安装类型: 表面贴装
封装/外壳: 20-SOIC(0.295",7.50mm 宽)
供应商设备封装: 20-SOIC W
包装: 管件
产品目录页面: 1234 (CN2011-ZH PDF)
16
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
3550.6
February 8, 2006
Die Characteristics
DIE DIMENSIONS:
2680
m x 2600m x 483m
METALLIZATION:
Type: Metal 1: AlCu (1%)
Thickness: Metal 1: 8k
±0.4k
Type: Metal 2: AlCu (1%)
Thickness: Metal 2: 16k
±0.8k
SUBSTRATE POTENTIAL (Powered Up):
V-
PASSIVATION:
Type: Nitride
Thickness: 4k
±0.4k
TRANSISTOR COUNT:
248
PROCESS:
High Frequency Bipolar Dielectric Isolation
Metallization Mask Layout
HA5024
9
8
3
220
19
13
11
1
4
6
7
10
12
14
-IN1
OUT1
-IN2
OUT2
OUT3
-IN3
+IN3
DIS3
V-
DIS4
+IN4
-IN4
15
17
18
+IN1
DIS1
V+
DIS2
+IN2
OUT4
HA5024
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