参数资料
| 型号： | HA9P5002-9 |
| 厂商： | Intersil |
| 文件页数： | 6/12页 |
| 文件大小： | 0K |
| 描述： | IC BUFFER 110MHZ HIGH OUT 8-SOIC |
| 标准包装： | 98 |
| 放大器类型： | 缓冲器 |
| 电路数： | 1 |
| 转换速率： | 1300 V/µs |
| -3db带宽： | 110MHz |
| 电流 - 输入偏压： | 2µA |
| 电压 - 输入偏移： | 5000µV |
| 电流 - 电源： | 8.3mA |
| 电流 - 输出 / 通道： | 220mA |
| 电压 - 电源，单路/双路(±)： | 10 V ~ 40 V，±5 V ~ 20 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
3
FN2921.12
October 18, 2013
Absolute Maximum Ratings
Thermal Information
Voltage Between V+ and V- Terminals . . . . . . . . . . . . . . . . . . . 44V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V1+ to V1-
Output Current (Continuous) . . . . . . . . . . . . . . . . . . . . . . . .
±200mA
Output Current (50ms On, 1s Off) . . . . . . . . . . . . . . . . . . . .
±400mA
Operating Conditions
Temperature Range
HA-5002-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
HA-5002-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +75°C
HA-5002-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Thermal Resistance
θJA (°C/W) θJC (°C/W)
Metal Can Package (Notes 3, 4) . . . . .
155
67
PLCC Package (Note 3). . . . . . . . . . . .
74
N/A
SOIC Package (Note 3) . . . . . . . . . . . .
157
N/A
Max Junction Temperature (Hermetic Packages, Note 2). . . . . +175°C
Max Junction Temperature (Plastic Packages, Note 2). . . . . . . +150°C
Max Storage Temperature Range . . . . . . . . . . . . . -65°C to +150°C
Max Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . +300°C
(PLCC and SOIC - Lead Tips Only)
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
2. Maximum power dissipation, including load conditions, must be designed to maintain the maximum junction temperature below +175°C for the
can packages, and below +150°C for the plastic packages.
3. For
θJA is measured with the component mounted on an evaluation PC board in free air.
4. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
VSUPPLY = ±12V to ±15V, RS = 50Ω, RL = 1kΩ, CL = 10pF, Unless Otherwise Specified
PARAMETER
TEST
CONDITIONS
TEMP
(°C)
HA-5002-2
HA-5002-5, -9
UNITS
MIN
TYP
MAX
MIN
TYP
MAX
INPUT CHARACTERISTICS
Offset Voltage
25
-
5
20
-
5
20
mV
Full
-
10
30
-
10
30
mV
Average Offset Voltage Drift
Full
-
30
-
30
-
μV/°C
Bias Current
25
-
2
7
-
2
7
μA
Full
-
3.4
10
-
2.4
10
μA
Input Resistance
Full
1.5
3
-
1.5
3
-
M
Ω
Input Noise Voltage
10Hz-1MHz
25
-
18
-
18
-
μVP-P
TRANSFER CHARACTERISTICS
Voltage Gain
(VOUT = ±10V)
RL = 50Ω
25
-
0.900
-
0.900
-
V/V
RL = 100Ω
25
-
0.971
-
0.971
-
V/V
RL = 1kΩ
25
-
0.995
-
0.995
-
V/V
RL = 1kΩ
Full
0.980
-
0.980
-
V/V
-3dB Bandwidth
VIN = 1VP-P
25
-
110
-
110
-
MHz
AC Current Gain
25
-
40
-
40
-
A/mA
OUTPUT CHARACTERISTICS
Output Voltage Swing
RL = 100Ω
25
±10
±10.7
-
±10
±11.2
-
V
RL = 1kΩ, VS = ±15V
Full
±10
±13.5
-
±10
±13.9
-
V
RL = 1kΩ, VS = ±12V
Full
±10
±10.5
-
±10
±10.5
-
V
Output Current
VIN = ±10V, RL = 40Ω
25
-
220
-
220
-
mA
Output Resistance
Full
-
3
10
-
3
10
Ω
Harmonic Distortion
VIN = 1VRMS, f = 10kHz
25
-
<0.005
-
<0.005
-
%
TRANSIENT RESPONSE
Full Power Bandwidth (Note 5)
25
-
20.7
-
20.7
-
MHz
Rise Time
25
-
3.6
-
3.6
-
ns
Propagation Delay
25
-
2
-
2
-
ns
Overshoot
25
-
30
-
30
-
%
Slew Rate
25
1.0
1.3
-
1.0
1.3
-
V/ns
Settling Time
To 0.1%
25
-
50
-
50
-
ns
Differential Gain
RL = 500Ω
25
-
0.06
-
0.06
-
%
Differential Phase
RL = 500Ω
25
-
0.22
-
0.22
-
°
HA-5002
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