参数资料
| 型号： | HA9P5127-5Z |
| 厂商： | Intersil |
| 文件页数： | 3/12页 |
| 文件大小： | 0K |
| 描述： | IC OPAMP 8.5MHZ PRECISION 8-SOIC |
| 标准包装： | 98 |
| 放大器类型： | 通用 |
| 电路数： | 1 |
| 转换速率： | 10 V/µs |
| 增益带宽积： | 8.5MHz |
| 电流 - 输入偏压： | 15nA |
| 电压 - 输入偏移： | 30µV |
| 电流 - 电源： | 3.5mA |
| 电流 - 输出 / 通道： | 25mA |
| 电压 - 电源，单路/双路(±)： | 10 V ~ 30 V，±5 V ~ 15 V |
| 工作温度： | 0°C ~ 75°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
| 产品目录页面： | 1234 (CN2011-ZH PDF) |
11
FN2906.8
November 29, 2011
HA-5127, HA-5127A
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 3, 3/11
DETAIL "A"
TOP VIEW
INDEX
AREA
12
3
-C-
SEATING PLANE
x 45°
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1982.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
SIDE VIEW “A
SIDE VIEW “B”
1.27 (0.050)
6.20 (0.244)
5.80 (0.228)
4.00 (0.157)
3.80 (0.150)
0.50 (0.20)
0.25 (0.01)
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
0.25(0.010)
0.10(0.004)
0.51(0.020)
0.33(0.013)
8°
0°
0.25 (0.010)
0.19 (0.008)
1.27 (0.050)
0.40 (0.016)
1.27 (0.050)
5.20(0.205)
1
2
3
4
5
6
7
8
TYPICAL RECOMMENDED LAND PATTERN
2.20 (0.087)
0.60 (0.023)
相关PDF资料 |
PDF描述 |
|---|---|
| HA9P5320-5Z | IC AMP SAMPLE&HOLD 2MHZ 16-SOIC |
| HC1000-0.020-02-0404 | THERMAL PAD 20MIL 4X4 GAPPAD |
| HF115AC-0.0055-AC-54 | THERM PAD TO-220 W/ADH HI-FLOW |
| HFA1100IBZ | IC OP AMP 850MHZ CFB 8-SOIC |
| HFA1110IBZ | IC BUFFER C-LOOP 750MHZ LD 8SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HA9P5127-5ZX96 | 功能描述:精密放大器 W/ANL OPAMP 8 5MHZ VFB PRECISION COM RoHS:否 制造商:Maxim Integrated 每芯片的通道数量: 输入补偿电压:0.25 mV at +/- 5 V 输入电压范围（最大值）: 安装风格: 封装 / 箱体:SOIC-8 Narrow 封装:Tube |
| HA9P5137-5 WAF | 制造商:Intersil Corporation 功能描述: |
| HA9P5137B4738 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HA9P5141-5 | 制造商:Harris Corporation 功能描述: |
| HA9P5142-5 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
发布紧急采购，3分钟左右您将得到回复。