参数资料
型号: HC55121IMZ
厂商: Intersil
文件页数: 31/36页
文件大小: 0K
描述: IC SLIC UNIVERSAL LP 28-PLCC
标准包装: 37
系列: UniSLIC14
功能: 用户线路接口概念(SLIC)
电路数: 1
电源电压: 4.75 V ~ 5.25 V
电流 - 电源: 2.25mA
功率(瓦特): 1.5W
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 28-LCC(J 形引线)
供应商设备封装: 28-PLCC(11.51x11.51)
包装: 管件
包括: 电池跟踪抗削顶失真,回路和接地键检测,振铃控制
4
FN4659.13
June 1, 2006
Absolute Maximum Ratings TA = 25°C
Thermal Information
Temperature, Humidity
Storage Temperature Range . . . . . . . . . . . . . . . . .-65°C to 150°C
Operating Temperature Range. . . . . . . . . . . . . . . . -40°C to 110°C
Operating Junction Temperature Range . . . . . . . .-40°C to 150°C
Power Supply (-40°C
≤ T
A ≤ 85°C)
Supply Voltage VCC to GND . . . . . . . . . . . . . . . . . . . . -0.4V to 7V
Supply Voltage VBL to GND . . . . . . . . . . . . . . . . . . . .-VBH to 0.4V
Supply Voltage VBH to GND, Continuous . . . . . . . . . -75V to 0.4V
Supply Voltage VBH to GND, 10ms . . . . . . . . . . . . . . -80V to 0.4V
Relay Driver
Ring Relay Supply Voltage . . . . . . . . . . . . . . . . . . . . . . 0V to 14V
Ring Relay Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
Digital Inputs, Outputs (C1, C2, C3, C4, C5, SHD, GKD_LVM)
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to VCC
Output Voltage (SHD, GKD_LVM Not Active) . . . . . -0.4V to VCC
Output Current (SHD, GKD_LVM) . . . . . . . . . . . . . . . . . . . . . 5mA
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500V
Gate Count. . . . . . . . . . . . . . . . . . . . . . . 543 Transistors, 51 Diodes
Tipx and Ringx Terminals (-40°C
≤ TA ≤ 85°C)
Tipx or Ringx Current . . . . . . . . . . . . . . . . . . . . -100mA to 100mA
Thermal Resistance (Typical, Note 1)
θJA
28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . .
52°C/W
28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . .
45°C/W
32 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . .
66.2°C/W
Continuous Power Dissipation at 85°C
28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5W
28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0W
32 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4W
Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . . . . . 300°C
(PLCC, SOIC - Lead Tips Only)
Derate above 70°C
Tip and Ring Terminals
Tipx or Ringx, Current, Pulse < 10ms, TREP > 10s . . . . . . . . . .2A
Tipx or Ringx, Current, Pulse < 1ms, TREP > 10s . . . . . . . . . . .5A
Tipx or Ringx, Current, Pulse < 10
s, T
REP > 10s . . . . . . . . . 15A
Tipx or Ringx, Current, Pulse < 1
s, TREP > 10s . . . . . . . . . .20A
Tipx or Ringx, Pulse < 250ns, TREP > 10s
20A
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JA is measured with the component mounted on an evaluation PC board in free air.
Typical Operating Conditions
These represent the conditions under which the device was developed and are suggested as guidelines.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Ambient Temperature
HC55120, HC55150/1
0
-
70
°C
HC55121, HC55130/1, HC55140/1,
HC55142/3
-40
-
85
°C
VBH with Respect to GND
-58
-
-8
V
VBL with Respect to GND
VBH
-0
V
VCC with Respect to GND
4.75
-
5.25
V
HC55120, HC55121, HC55130, HC55140, HC55142, HC55143, HC55150
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