参数资料
型号: HCP0704-4R7-R
厂商: Cooper Bussmann
文件页数: 1/4页
文件大小: 0K
描述: INDUCTOR HI CURNT 4.7UH 5.0A SMD
特色产品: FP/HCP Series Inductors
标准包装: 1
系列: HCP0704
电感: 4.7µH
电流: 5A
电流 - 饱和: 8A
类型: 铁粉芯
容差: ±25%
屏蔽: 屏蔽
DC 电阻(DCR): 29.5 毫欧
材料 - 芯体: 铁粉
封装/外壳: 0.268" L x 0.268" W x 0.165" H(6.80mm x 6.80mm x 4.20mm)
安装类型: 表面贴装
包装: 标准包装
工作温度: -40°C ~ 155°C
频率 - 测试: 100kHz
产品目录页面: 1749 (CN2011-ZH PDF)
其它名称: 513-1645-6
High Current, High Frequency, Power Inductors
HCP0704 Series
Applications:
? Voltage Regulator Module (VRM)
? Multi-phase regulators
? Desktop and servers
HALOGEN
HF
FREE
?
?
?
?
?
?
Base station equipment
Notebook regulators
Data networking and storage systems
Point-of-load modules
Battery power systems
DCR sensing
SMD Device
Description:
Environmental Data:
? Storage temperature range: -40°C to +155°C
? Operating temperature range: -40°C to +155°C
?
?
?
?
?
?
?
?
?
?
?
?
Halogen free
155°C maximum total temperature operation
6.8 x 6.8 x 4.2mm surface mount package
Powder iron core material
Magnetically shielded, low EMI
High temperature core material eliminates thermal aging issues
High current carrying capacity, low core losses
Controlled DCR tolerance for sensing circuits
Inductance range from 0.40 μ H to 4.7 μ H
Current range from 5.0 to 27 amps
Frequency range up to 2MHz
RoHS compliant
(Range is application specific)
? Solder reflow temperature: J-STD-020D compliant
Packaging:
? Supplied in tape-and-reel packaging, 1000 parts per reel,
13” diameter reel
Product Specifications
Part Number 6
HCP0704-R40-R
HCP0704-R60-R
HCP0704-1R0-R
HCP0704-1R8-R
HCP0704-2R3-R
HCP0704-3R3-R
HCP0704-4R7-R
OCL 1 ± 25% ( μ H)
0.40
0.60
1.00
1.80
2.30
3.30
4.70
FLL 2 Min. ( μ H)
0.28
0.42
0.7
1.26
1.56
2.31
3.29
Irms 3 (Amps)
17
14
12
8.5
7.5
6.0
5.0
Isat 4 @ 25°C (Amps)
27
21
17
13
11.5
9.5
8.0
DCR (m Ω ) @ 20°C
3.2 ±10%
4.5 ±10%
6.2 ±10%
11.0 ±10%
16.5 ±10%
25.0 ±10%
29.5 ±10%
K-factor 5
383.1
313.5
265.3
202.8
164.2
149.9
127.7
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 155°C under worst case operating conditions verified in the end
application.
4 Isat: Peak current for approximately 20% rolloff at +25°C.
5 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * Δ I : (Gauss), K: (K-factor
from table), L: (inductance in μ H), Δ I (peak-to-peak ripple current in amps).
6 Part Number Definition: HCP0704-xxx-R
? HCP0704 = Product code and size
? xxx= Inductance value in μ H, R = decimal point. If no “R” is present, then
third character = # of zeros
? “-R” suffix = RoHS compliant
0209
BU-SB09086
Page 1 of 4
Data Sheet: 4348
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相关代理商/技术参数
参数描述
HCP0704-R40-R 功能描述:固定电感器 0.4uH 27A RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm
HCP0704-R60-R 功能描述:固定电感器 0.6uH 21A RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm
HCP0805-1R0-R 功能描述:固定电感器 1.0uH 22A RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm
HCP0805-1R5-R 功能描述:固定电感器 1.5uH 18A RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm
HCP0805-2R2-R 功能描述:固定电感器 2.2uH 14A RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm