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| 型号： | HCP0805-R40-R |
| 厂商： | Cooper Bussmann |
| 文件页数： | 1/4页 |
| 文件大小： | 0K |
| 描述： | INDUCTOR HI CURNT 0.40UH 20A SMD |
| 特色产品： | FP/HCP Series Inductors |
| 标准包装： | 700 |
| 系列： | HCP0805 |
| 电感： | 400nH |
| 电流： | 20A |
| 电流 - 饱和： | 32A |
| 类型： | 铁粉芯 |
| 容差： | ±20% |
| 屏蔽： | 屏蔽 |
| DC 电阻(DCR)： | 3.1 毫欧 |
| 材料 - 芯体： | 铁粉 |
| 封装/外壳： | 0.311" L x 0.299" W x 0.197" H（7.90mm x 7.60mm x 5.00mm） |
| 安装类型： | 表面贴装 |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 125°C |
| 频率 - 测试： | 100kHz |
High Current, High Frequency, Power Inductors
HCP0805 Series
Applications:
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Voltage Regulator Module (VRM)
Multi-phase regulators
Desktop and servers
Base station equipment
Notebook regulators
Data networking and storage systems
Point-of-load modules
Battery power systems
DCR sensing
SMD Device
Description:
Environmental Data:
? Storage temperature range: -40°C to +125°C
? Operating temperature range: -40°C to +125°C
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Halogen free
125°C maximum total temperature operation
7.6 x 7.9 x 5.0mm surface mount package
Powder iron core material
Magnetically shielded, low EMI
High current carrying capacity, Low core losses
Controlled DCR tolerance for sensing circuits
Inductance range from 0.40 μ H to 2.2 μ H
Current range from 10.0 to 32 amps
Frequency range up to 2MHz
RoHS compliant
(Range is application specific)
? Solder reflow temperature: J-STD-020D compliant
Packaging:
? Supplied in tape-and-reel packaging, 700 parts per reel,
13” diameter reel
Product Specifications
Part Number 6
HCP0805-R40-R
HCP0805-R68-R
HCP0805-1R0-R
HCP0805-1R5-R
HCP0805-2R2-R
OCL 1 ± 20% ( μ H)
0.40
0.68
1.00
1.50
2.20
FLL 2 Min. ( μ H)
0.26
0.44
0.64
0.96
1.41
Irms 3 (Amps)
20
17.5
14.5
13.3
10
Isat 4 @ 25°C (Amps)
32
25
22
18
14
DCR (m Ω ) @ 20°C
3.1 ±6.0%
4.5 ±6.0%
5.8 ±6.0%
6.8 ±6.0%
11.2 ±6.0%
K-factor 5
376.0
292.0
239.0
202.0
175.0
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
4 Isat: Peak current for approximately 20% rolloff at +25°C.
5 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * Δ I. Bp-p : (Gauss), K:
(K-factor from table), L: (inductance in μ H), Δ I (peak-to-peak ripple current in amps).
6 Part Number Definition: HCP0805-xxx-R
? HCP0805 = Product code and size
? xxx= Inductance value in μ H, R = decimal point. If no “R” is present, then
third character = # of zeros.
? “-R” suffix = RoHS compliant
1108
BU-SB08798
Page 1 of 4
Data Sheet: 4349
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