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参数资料
| 型号： | HD6417750S |
| 英文描述： | MCU AVR 8K FLASH 15MHZC 20-QFN |
| 中文描述： | 微机开发环境系统高性能的Embedded Workshop 2福利部生成器用户手册/交叉工具的性能 |
| 文件页数： | 10/67页 |
| 文件大小： | 382K |
| 代理商： | HD6417750S |
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Rev. 2.0, 03/06/02, 9
2.
Build Basics
This chapter explains the general functions of the HEW whilst the more advanced features can be found in
chapter 3, “Advanced Build Features”.
2.1
The Build Process
The typical build process is outlined in figure 2.1. This may not be the exact build process, which your
installation of HEW will use as it depends upon the tools that were provided with your installation of HEW (e.g.
you may not have a compiler for instance). In any case, the principles are the same - each step or phase of the
build takes a set of project files and then builds them, if all succeeds then the next step or phase is executed.
Project
Object
Files
C
Source Files
Assembler
Source Files
Library
Files
Load
Module
BUILD
COMPILER
ASSEMBLER
LINKER
Figure 2.1: Typical Build Process
In the example shown in figure 2.1 the compiler is the first phase, the assembler is the second phase and the
linker is the third and final phase. During the compiler phase, the C source files from the project are compiled in
turn, during the assembler phase, the assembler source files are assembled in turn. During the linker phase all
library files and output files from the compiler and assembler phases are linked together to produce the load
module. This module can then be downloaded and used by the debugger functionality in HEW.
The build process can be customized in several ways. For instance, you can add your own phase, disable a phase,
delete phases and so forth. These advanced build issues are left to chapter 3, “Advanced Build Features”. In this
chapter, only the general principles and basic features will be detailed.
相关PDF资料 |
PDF描述 |
|---|---|
| HD6432132 | IC MCU AVR32 256KB FLASH 48-TQFP |
| HD6432134S | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD6432142 | H8S/2148 Series.H8S/2144 Series.H8S/2148 F-ZTAT.H8S/2147N F-ZTAT.H8S/2144 F-ZTAT.H8S/2142 F-ZTAT Hardware Manual |
| HD6432144S | H8S/2148 Series.H8S/2144 Series.H8S/2148 F-ZTAT.H8S/2147N F-ZTAT.H8S/2144 F-ZTAT.H8S/2142 F-ZTAT Hardware Manual |
| HD643180XP-8L | 8-BIT, MROM, 8 MHz, MICROCONTROLLER, PDIP90 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HD6417750SBA200V | 制造商:Renesas Electronics Corporation 功能描述:IC MCU 32BIT ROMLESS 256BGA |
| HD6417750SBP200 | 制造商:RENESAS 制造商全称:Renesas Technology Corp 功能描述:SuperH RISC engine |
| HD6417750SBP200V | 功能描述:MPU 1.95/3.3V 0K PB-FREE 256-BGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:SuperH® SH7750 标准包装:160 系列:S08 核心处理器:S08 芯体尺寸:8-位 速度:40MHz 连通性:I²C，LIN，SCI，SPI 外围设备:LCD，LVD，POR，PWM，WDT 输入/输出数:53 程序存储器容量:32KB（32K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:1.9K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 5.5 V 数据转换器:A/D 12x12b 振荡器型:内部 工作温度:-40°C ~ 105°C 封装/外壳:64-LQFP 包装:托盘 |
| HD6417750SF167 | 制造商:RENESAS 制造商全称:Renesas Technology Corp 功能描述:SuperH RISC engine |
| HD6417750SF167I | 功能描述:IC SUPERH MPU ROMLESS 208QFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:SuperH® SH7750 产品培训模块:MCU Product Line Introduction XMEGA Introduction AVR XMEGA USB Connectivity 标准包装:90 系列:AVR® XMEGA 核心处理器:AVR 芯体尺寸:8/16-位 速度:32MHz 连通性:I²C，IrDA，SPI，UART/USART 外围设备:欠压检测/复位，DMA，POR，PWM，WDT 输入/输出数:50 程序存储器容量:192KB（96K x 16） 程序存储器类型:闪存 EEPROM 大小:4K x 8 RAM 容量:16K x 8 电压 - 电源 (Vcc/Vdd):1.6 V ~ 3.6 V 数据转换器:A/D 16x12b; D/A 2x12b 振荡器型:内部 工作温度:-40°C ~ 85°C 封装/外壳:64-TQFP 包装:托盘 配用:ATSTK600-RC14-ND - STK600 SOCKET/ADAPTER 64TQFPATSTK600-TQFP64-ND - STK600 SOCKET/ADAPTER 64-TQFPATAVRONEKIT-ND - KIT AVR/AVR32 DEBUGGER/PROGRMMRATAVRISP2-ND - PROGRAMMER AVR IN SYSTEM |
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