参数资料
| 型号： | HDAF-11-08.0-S-13-2 |
| 厂商： | Samtec Inc |
| 文件页数： | 1/1页 |
| 文件大小： | 0K |
| 描述： | CONN HD ARRAY 143POS FEMALE GOLD |
| 产品目录绘图： | HDAF Series |
| 标准包装： | 1 |
| 系列： | HD Mezz™ HDAF |
| 连接器类型： | 高密度阵列，母形 |
| 位置数： | 143 |
| 间距： | 0.047"（1.20mm） |
| 行数： | 13 |
| 安装类型： | 表面贴装 |
| 特点： | 板导轨 |
| 触点表面涂层： | 金 |
| 触点涂层厚度： | 30µin（0.76µm） |
| 包装： | 托盘 |
| 配接层叠高度： | 20mm，25mm |
| 板上方高度： | 0.414"（10.51mm） |
| 配套产品： | SAM8645-ND - CONN HD ARRAY 143POS MALE GOLD SAM8639-ND - CONN HD ARRAY 143POS MALE GOLD SAM8644-ND - CONN HD ARRAY 143POS MALE GOLD SAM8638-ND - CONN HD ARRAY 143POS MALE GOLD |
| 其它名称： | SAM8651 |
F-214
(2,00 mm) .0787"
MEZZ
HDAM –11–12.0 –S –13 –2
HDAF –11–08.0 –S –13 –2
HDAM, HDAF SERIES
RUGGED ELEVATED HIGH DENSITY ARRAY
HDAM Mates with:
HDAF
HDAF Mates with:
HDAM
NO. OF PINS
PER ROW
LEAD
STYLE
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
OTHER
OPTION
HDAM
SPECIFICATIONS
For complete speci?cations and
recommended PCB layouts see
www.samtec.com?HDAM or
www.samtec.com?HDAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
–11, –15, –23
Specify
LEAD
STYLE
from
chart
–S
= 30μ"
(0,76 μm)
Gold on
contact area,
Matte Tin
on tails and
guide pins
–13
–2
= Lead-Free
Tin Alloy
95.5% Sn/
3.8% Ag/0.7%
Cu
Solder Charge
–P
= Pick &
Place Pad
Plating:
Au or Sn over
(22,50) .886
A
A
–12.0
–17.0
50μ" (1,27 μm) Ni
Current Rating:
3.4 A per pin
(6 adjacent pins powered)
Operating Temp Range:
-55°C to +125°C
Contact Resistance: 19 m Ω
Working Voltage: 200 VAC
Mated Cycles: 100
RoHS Compliant: Yes
Lead-Free Solderable: Yes
RECOGNITIONS
For complete scope of
1A
(2,00)
.0787
1M
No. of
Pins
Per
Row
x
(2,00)
.0787
+
(16,06)
.632
No. of
Pins
Per
Row
x
(2,00)
.0787
+
(11,55)
.455
LEAD
STYLE
(14,41)
.567
(19,41)
.764
HDAM/HDAF
35 mm Stack Height
Single-Ended
Signaling
Differential Pair
Signaling
? Integrated guide
posts
Rated @ 3dB Insertion Loss*
9 GHz / 18 Gbps
9 GHz / 18 Gbps
recognitions see
*Data based on simulations using Final Inch ? design.
www.samtec.com/quality
(1,20)
.0472
(5,09) .200
*Performance data includes effects of a
non-optimized PCB.
Performance data for other stack heights and complete
test data available at www.samtec.com?HDAM,
DIFFERENTIAL
www.samtec.com?HDAF or contact sig@samtec.com
APPLICATIONS
(1,20)
.0472
HDAF
NO. OF PINS
PER ROW
LEAD
STYLE
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
OTHER
OPTION
(2,00)
.0787
PAIR
ARRAY COUNT*
11x13 44
15x13 60
23x13 92
–11, –15, –23
(22,50) .886
Specify
LEAD
STYLE
from
chart
–S
= 30μ"
(0,76 μm)
Gold on
contact area,
Matte Tin
on tails and
weld tabs
–13
–2
= Lead-Free
Tin Alloy
95.5% Sn/
3.8% Ag/
0.7% Cu
Solder Charge
–P
= Pick &
Place Pad
*2:1 S:G Ratio
No.
of
Pins
No.
ALSO AVAILABLE
(MOQ Required)
? Tin-Lead Solder Charge
Per
Row
x
(2,00)
.0787
+
of
Pins
Per
Row
x
(2,00)
? Other platings
Contact Samtec.
Note: HD Mezz is a trademark
of Molex Incorporated
Note: Some lengths, styles
and options are non-standard,
non-returnable.
1A
(2,00)
.0787
(11,55)
.455
1M
(1,20)
.0472
LEAD
STYLE
–08.0
–18.0
A
(10,51)
.414
(20,51)
.807
.0787
+
(17,92)
.706
A
? Integrated guide
posts
WWW.SAMTEC.COM
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参数描述 |
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| HDAF-11-18.0-S-13-1 | 功能描述:CONN HD ARRAY 143POS FEMALE GOLD RoHS:否 类别:连接器，互连式 >> 板对板 - 阵列，边缘类型，包厢 系列:HD Mezz™ HDAF 标准包装:16 系列:FX6 连接器类型:接头，外罩触点 位置数:60 间距:0.031"（0.80mm） 行数:2 安装类型:表面贴装 特点:板导轨 触点表面涂层:金 触点涂层厚度:- 包装:管件 配接层叠高度:6mm，8mm 板上方高度:0.236"（6.00mm） 其它名称:*FX6-60P-0.8SV1H2417 |
| HDAF-11-18.0-S-13-1 | 制造商:Samtec Inc 功能描述:CONNECTOR HD FEMALE 143WAY |
| HDAF-11-18.0-S-13-1-P | 制造商:Samtec Inc 功能描述:2.0MM PITCH HD ARRAY SOCKET ASSEMBLY - Bulk |
| HDAF-11-18.0-S-13-2 | 功能描述:CONN HD ARRAY 143POS FEMALE GOLD RoHS:是 类别:连接器，互连式 >> 板对板 - 阵列，边缘类型，包厢 系列:HD Mezz™ HDAF 标准包装:16 系列:FX6 连接器类型:接头，外罩触点 位置数:60 间距:0.031"（0.80mm） 行数:2 安装类型:表面贴装 特点:板导轨 触点表面涂层:金 触点涂层厚度:- 包装:管件 配接层叠高度:6mm，8mm 板上方高度:0.236"（6.00mm） 其它名称:*FX6-60P-0.8SV1H2417 |
| HDAF-11-18.0-S-13-2 | 制造商:Samtec Inc 功能描述:CONNECTOR HD FEMALE 143WAY |
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