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参数资料
| 型号： | HDAF-23-18.0-S-13-2-P |
| 厂商： | SAMTEC INC |
| 元件分类： | 电路板相叠连接器 |
| 英文描述： | 299 CONTACT(S), FEMALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT, SOCKET |
| 封装： | ROHS COMPLIANT |
| 文件页数： | 1/1页 |
| 文件大小： | 798K |
| 代理商： | HDAF-23-18.0-S-13-2-P |
(2,00mm) .0787"
HDAM, HDAF SERIES
HDAM–11–12.0–S–13–2
HDAF–23–08.0–S–13–2
WWW.SAMTEC.COM
HDAM Mates with:
HDAF
HDAF Mates with:
HDAM
For complete specications and
recommended PCB layouts see
www.samtec.com?HDAM or
www.samtec.com?HDAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Current Rating:
2.3A @ 80°C ambient
Operating Temp Range:
-55°C to +125°C
Plating:
Au or Sn over
50" (1,27m) Ni
Contact Resistance:
19 m
Ω max
Working Voltage:
200 VAC
Mated Cycles:
100
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
F-210-1
SPECIFICATIONS
finalinch.com
MEZZ
DIFFERENTIAL
APPLICATIONS
PAIR
COUNT*
ARRAY
44
60
92
11x13
15x13
23x13
(1,20)
.0472
(2,00)
.0787
*2:1 S:G Ratio
Note: HD Mezz is a trademark
of Molex Incorporated
Note: Some lengths, styles
and options are non-standard,
non-returnable.
ALSO AVAILABLE
Tin-Lead Solder Charge.
Call Samtec.
Note: Other Gold plating
options available.
Contact Samtec.
HDAM
NO. OF PINS
PER ROW
PLATING
OPTION
OTHER
OPTION
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
–P
= Pick &
Place Pad
–S
= 30"
(0,76m)
Gold on
contact area,
Matte Tin
on tails and
guide pins
SOLDER
TYPE
NO. OF
ROWS
–13
–2
= Lead-Free
Tin Alloy
95.5% Sn/
3.8% Ag/0.7% Cu
Solder Charge
–11, –15, –23
HDAF
NO. OF PINS
PER ROW
PLATING
OPTION
OTHER
OPTION
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
–P
= Pick &
Place Pad
–S
= 30"
(0,76m)
Gold on
contact area,
Matte Tin
on tails and
weld tabs
SOLDER
TYPE
NO. OF
ROWS
–13
–2
= Lead-Free
Tin Alloy
95.5% Sn/
3.8% Ag/
0.7% Cu
Solder Charge
–11, –15, –23
LEAD
STYLE
–12.0
–17.0
A
(14,41)
.567
(19,41)
.764
(2,00)
.0787
(22,50)
.886
No. of
Pins
Per
Row
x
(2,00)
.0787
+
(11,55)
.455
No. of
Pins
Per
Row
x
(2,00)
.0787
+
(16,06)
.632
A
1A
1M
(1,20)
.0472
(5,09)
.200
LEAD
STYLE
–08.0
–18.0
A
(10,51)
.414
(20,51)
.807
No.
of
Pins
Per
Row
x
(2,00)
.0787
+
(17,92)
.706
A
No.
of
Pins
Per
Row
x
(2,00)
.0787
+
(11,55)
.455
(22,50) .886
(1,20)
.0472
(2,00)
.0787
1A
1M
35mm Stack Height
Rated @ -3dB
Insertion Loss*
Single-Ended Signaling
9.0 GHz / 18.0 Gbps
Differential Pair Signaling
9.0 GHz / 18.0 Gbps
*Data based on simulations using Final Inch design.
Performance data for other stack heights and complete
test data available at www.samtec.com?HDAM,
www.samtec.com?HDAF or contact sig@samtec.com
RUGGED ELEVATED HIGH DENSITY ARRAY
Integrated guide
posts
Integrated guide
posts
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