参数资料
型号: HFA1145IPZ
厂商: Intersil
文件页数: 4/13页
文件大小: 0K
描述: IC OPAMP CFA 330MHZ LP 8-PDIP
标准包装: 500
应用: 电流反馈
电路数: 1
-3db带宽: 330MHz
转换速率: 2100 V/µs
电流 - 电源: 5.8mA
电流 - 输出 / 通道: 60mA
电压 - 电源,单路/双路(±): 9 V ~ 11 V,±4.5 V ~ 5.5 V
安装类型: 通孔
封装/外壳: 8-DIP(0.300",7.62mm)
供应商设备封装: 8-PDIP
包装: 管件
12
FN3955.5
June 1, 2006
Die Characteristics
DIE DIMENSIONS:
59 mils x 59 mils x 19 mils
1500
μm x 1500μm x 483μm
METALLIZATION:
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8k
±0.4k
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16k
±0.8k
PASSIVATION:
Type: Nitride
Thickness: 4k
±0.5k
TRANSISTOR COUNT:
75
SUBSTRATE POTENTIAL (Powered Up):
Floating (Recommend Connection to V-)
Metallization Mask Layout
HFA1145
V-
OPTIONAL GND (NOTE)
OUT
+IN
-IN
V+
NOTE: This pad is not bonded out on packaged units. Die users may set a GND reference, via this pad, to ensure the TTL compatibility
of the DIS input when using asymmetrical supplies (e.g. V+ = 10V, V- = 0V). See the “Application Information” section for details.
DISABLE
HFA1145
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