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参数资料
| 型号： | HFA3726 |
| 厂商： | HARRIS SEMICONDUCTOR |
| 元件分类： | 通信及网络 |
| 英文描述： | 288 MACROCELL 3.3 VOLT ISP CPLD |
| 中文描述： | SPECIALTY TELECOM CIRCUIT |
| 封装： | LOW PROFILE, SURFACE MOUNT PACKAGE |
| 文件页数： | 21/21页 |
| 文件大小： | 162K |
| 代理商： | HFA3726 |
21
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
HFA3726
Thin Plastic Quad Flatpack Packages (LQFP)
D
D1
E E1
-A-
PIN 1
A2 A1
A
11
o
-13
o
11
o
-13
o
0
o
-7
o
0.020
0
o
MIN
L
PLANE
b
0.004/0.008
0.09/0.20
WITH PLATING
BASE METAL
SEATING
0.004/0.006
0.09/0.16
b1
-B-
e
0.005
0.13
A-B
S
D
S
C
M
0.08
0.003
-C-
-D-
-H-
0.25
0.010
GAGE
PLANE
Q80.14x14
(JEDEC MS-026BEC ISSUE C)
80 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
SYM-
BOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.062
-
1.60
-
A1
0.002
0.005
0.05
0.15
-
A2
0.054
0.057
1.35
1.45
-
b
0.009
0.014
0.22
0.38
6
b1
0.009
0.012
0.22
0.33
-
D
0.626
0.634
15.90
16.10
3
D1
0.547
0.555
13.90
14.10
4, 5
E
0.626
0.634
15.90
16.10
3
E1
0.547
0.555
13.90
14.10
4, 5
L
0.018
0.029
0.45
0.75
-
N
80
80
7
e
0.026 BSC
0.65 BSC
-
Rev. 2 4/99
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane
4. Dimensions D1 and E1 to be determined at datum plane
.
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm (0.003 inch).
7. “N” is the number of terminal positions.
.
-C-
-H-
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HFA3726/3728 WAF | 制造商:Harris Corporation 功能描述: |
| HFA3726IA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:RF Modulator/Demodulator |
| HFA3726IA96 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:RF Modulator/Demodulator |
| HFA3726IN | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HFA3726IN WAF | 制造商:Harris Corporation 功能描述: |
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