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参数资料
| 型号： | HFA3983 |
| 厂商： | HARRIS SEMICONDUCTOR |
| 元件分类： | 衰减器 |
| 英文描述： | 2.4GHz Power Amplifier and Detector(2.4GHz 功率放大器探测器) |
| 中文描述： | 2400 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 文件页数： | 7/7页 |
| 文件大小： | 133K |
| 代理商： | HFA3983 |
4-7
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
HFA3983
Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP)
α
INDEX
AREA
E1
D
N
1
2
3
-B-
0.10(0.004)
C A
M
B S
e
-A-
b
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
c
E
0.25(0.010)
B
M
M
L
0.25
0.010
GAUGE
PLANE
A2
0.05(0.002)
TOP VIEW
P1
1
2
3
P
BOTTOM VIEW
N
M28.173A
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A
A1
A2
b
c
D
E1
e
E
L
N
α
P
P1
NOTES:
1. Thesepackagedimensionsarewithinallowabledimensions
of JEDEC MO-153-AET, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or
gate burrs. Mold flash, protrusion and gate burrs shall not
exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protru-
sions. Interlead flash and protrusions shall not exceed
0.15mm (0.006 inch) per side.
5. Thechamferonthebodyisoptional.Ifitisnotpresent,avisual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allow-
able dambar protrusion shall be 0.08mm (0.003 inch) total
in excess of “b” dimension at maximum material condition.
Minimum space between protrusion and adjacent lead is
0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch di-
mensions are not necessarily exact. (Angles in degrees)
11. Dimensions “P” and “P1” are thermal and/or electrical en-
hanced variations. Values shown are maximum size of ex-
posed pad within lead count and body size.
INCHES
MIN
-
0.002
0.031
0.0075
0.0035
0.378
0.169
0.026 BSC
0.246
0.0177
MILLIMETERS
MIN
-
0.05
0.80
0.19
0.09
9.60
4.30
0.65 BSC
6.25
0.45
28
0
o
-
-
NOTES
-
-
-
9
-
3
4
-
-
6
7
-
11
11
Rev. 1 6/99
MAX
0.047
0.006
0.051
0.0118
0.0079
0.386
0.177
MAX
1.20
0.15
1.05
0.30
0.20
9.80
4.50
0.256
0.0295
6.50
0.75
28
0
o
-
-
8
o
0.138
0.118
8
o
3.50
3.0
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