
21
Electrical/Optical Characteristics -40 °C to + 85 °C unless otherwise specified
Fiber sizes with core diameter
≤ 100 m and NA ≤ 0.35, 4.75 V ≤ VCC ≤ 5.25 V
Dynamic Characteristics
-40 °C to +85 °C unless otherwise specified; 4.75 V
≤ VCC ≤ 5.25 V; BER ≤ 10-9
Notes:
1. 2.0 mm from where leads enter case.
2. 8 mA load (5 x 1.6 mA), RL = 560 W.
3. Typical data at TA = +25 °C, VCC = 5.0 Vdc.
4. D is the effective diameter of the detector image on the plane of the fiber face. The numerical value is the product of the actual detector diameter
and the lens magnification.
5. Measured at the end of 100/140 mm fiber optic cable with large area detector.
6. Propagation delay through the system is the result of several sequentially-occurring phenomena. Consequently it is a combination of data-rate-
limiting effects and of transmission-time effects. Because of this, the data-rate limit of the system must be described in terms of time differentials
between delays imposed on falling and rising edges.
7.
As the cable length is increased, the propagation delays increase at 5 ns per meter of length. Data rate, as limited by pulse width distortion, is not
affected by increasing cable length if the optical power level at the receiver is maintained.
Parameter
Symbol
Min
Typ3
Max
Units
Conditions
Reference
High Level Output Current
IOH
5
250
A
VO = 18
PR < -40 dBm
Low Level Output Voltage
VOL
0.4
0.5
V
IO = 8 mA
PR > -24 dBm
High Level Supply Current
ICCH
3.5
6.3
mA
VCC = 5.25 V
PR < -40 dBm
Low Level Supply Current
ICCL
6.2
10
mA
VCC = 5.25 V
PR > -24 dBm
Equivalent NA
NA
0.50
Optical Port Diameter
D
400
m
Note 4
Parameter
Symbol
Min
Typ3
Max
Units
Conditions
Reference
Peak Optical Input Power Logic Level HIGH
PRH
-40
0.1
dBm pk
W pk
lP = 820 nm
Note 5
Peak Optical Input Power Logic Level LOW
PRL
-25.4
2.9
-24.0
4.0
-9.2
120
-10.0
100
dBm pk
W pk
dBm pk
W pk
TA = +25 °C,
IOL = 8mA
Note 5
Propagation Delay LOW to HIGH
tPLHR
65
ns
TA = +25 °C,
PR = -21 dBm,
Data Rate =
5 MBd
Note 6
Propagation Delay HIGH to LOW
tPHLR
49
ns
CAUTION: The small junction sizes inherent to the design of these components increase the components’ susceptibility to damage
from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of these
components to prevent damage and/or degradation which may be induced by ESD.