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参数资料
| 型号： | HI-549 |
| 厂商： | Intersil Corporation |
| 英文描述： | Single 16 and 8, Differential 8-Channel and 4-Channel CMOS Analog MUXs with Active Overvoltage Protection |
| 中文描述： | 单16和8，差分8通道和4通道CMOS模拟MUXs与Active过压保护 |
| 文件页数： | 15/15页 |
| 文件大小： | 329K |
| 代理商： | HI-549 |
15
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
Die Characteristics
DIE DIMENSIONS:
83 mils x 108 mils
METALLIZATION:
Type: CuAl
Thickness: 16k
±
2k
SUBSTRATE POTENTIAL (NOTE):
-V
SUPPLY
PASSIVATION:
Type: Nitride Over Silox
Nitride Thickness: 3.5k
±
1k
Silox Thickness: 12k
±
2k
WORST CASE CURRENT DENSITY:
1.4 x 10
5
A/cm
TRANSISTOR COUNT:
253
PROCESS:
CMOS-DI
NOTE: The substrate appears resistive to the -V
SUPPLY
terminal, therefore it may be left floating (Insulating Die Mount) or it may be mounted on a
conductor at -V
SUPPLY
potential.
Metallization Mask Layouts
HI-548
HI-549
IN 6
(11)
IN 7 IN 8
(10)
OUT
(8)
IN 4
(7)
IN 3
(6)
IN 1
(4)
IN 2
(5)
-V
(3)
A
0
(1)
A
1
(16)
A
2
(15)
EN
(2)
IN 5
(12)
GND
(14)
+V
(13)
(9)
IN 3B IN 4BOUT B
(11)
(10)
OUT A
(8)
IN 4A IN 3A
(7)
IN 1A
(4)
IN 2A
(5)
-V
(3)
A
0
(1)
A
1
(16)
GND
(15)
EN
(2)
IN 2B
(12)
+V
(14)
IN 1B
(13)
(9)
(6)
HI-546, HI-547, HI-548, HI-549
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HI5628 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:8-Bit, 165/125/60MSPS, Dual High Speed CMOS D/A Converter |
| HI5628/16IN | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:8-Bit, 165/125/60MSPS, Dual High Speed CMOS D/A Converter |
| HI5628/6IN | 功能描述:DAC DUAL 8BIT 60MSPS 48LQFP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率（每秒）:* |
| HI5628/6IN-T | 功能描述:DAC DUAL 8BIT 60MSPS 48LQFP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率（每秒）:* |
| HI5628/6INZ | 功能描述:数模转换器- DAC D/A DL 8-BIT 60MSPS LQFP IND TEMPHI5728I RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
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