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参数资料
| 型号： | HI-5883 |
| 厂商： | Intersil Corporation |
| 英文描述： | 6-Bit, 30 MSPS Flash A/D Converter(6位、30MSPS 闪速A/D转换器) |
| 中文描述： | 6位，30 MSPS的闪光的A / D转换器（6位，30MSPS闪速的A / D转换器） |
| 文件页数： | 8/8页 |
| 文件大小： | 65K |
| 代理商： | HI-5883 |
6-21
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (407) 727-9207
FAX: (407) 724-7240
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
ASIA
Intersil (Taiwan) Ltd.
Taiwan Limited
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
HI-5701/883
Packaging
FRIT SEAL DUAL-IN-LINE CERAMIC PACKAGE
bbb
C A - B
S
c
Q
L
A
SEATING
PLANE
BASE
PLANE
D
S
S
-D-
-A-
-C-
e
A
-B-
aaa
C A - B
M
D
S
S
ccc
C A - B
M
D
S
S
α
D
E
S1
b2
b
A
e
M
c1
b1
(c)
(b)
SECTION A-A
BASE
METAL
LEAD FINISH
e
A/2
A
M
F18.3
MIL-STD-1835 GDIP1-T18 (D-6, CONFIGURATION A)
18 LEAD FRIT SEAL DUAL-IN-LINE CERAMIC PACKAGE
SYMBOL
A
b
b1
b2
b3
c
c1
D
E
e
eA
eA/2
L
Q
S1
S2
α
aaa
bbb
ccc
M
N
INCHES
MIN
-
0.014
0.014
0.045
0.023
0.008
0.008
-
0.220
0.100 BSC
0.300 BSC
0.150 BSC
0.125
0.015
0.005
0.005
90
o
MILLIMETERS
MIN
-
0.36
0.36
1.14
0.58
0.20
0.20
-
5.59
2.54 BSC
7.62 BSC
3.81 BSC
3.18
0.38
0.13
0.13
90
o
NOTES
-
2
3
-
4
2
3
5
5
-
-
-
-
6
7
MAX
0.200
0.026
0.023
0.065
0.045
0.018
0.015
0.960
0.310
MAX
5.08
0.66
0.58
1.65
1.14
0.46
0.38
24.38
7.87
0.200
0.070
-
-
105
o
5.08
1.78
-
-
105
o
-
-
-
-
-
0.015
0.030
0.010
0.0015
-
-
-
-
0.38
0.76
0.25
0.038
-
-
-
2
8
18
18
NOTES:
1. Index area: A notch or a pin one identification mark shall be located
adjacent to pin one and shall be located within the shaded area
shown. The manufacturer’s identification shall not be used as a pin
one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be mea-
sured at the centroid of the finished lead surfaces, when solder dip
or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension M
applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial
lead paddle. For this configuration dimension b3 replaces dimension
b1.
5. This dimension allows for off-center lid, meniscus, and glass overrun.
6. Dimension Q shall be measured from the seating plane to the base
plane.
7. Measure dimension S1 at all four corners.
8. N is the maximum number of terminal positions.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling Dimension: Inch.
Spec Number
512031
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