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参数资料
| 型号： | HI-CV CAP 1002 |
| 厂商： | TDK Corporation |
| 文件页数： | 63/72页 |
| 文件大小： | 0K |
| 描述： | KIT CAP CER 1UF - 10UF |
| 标准包装： | 1 |
| 系列： | C |
| 套件类型： | 通用型，陶瓷 MLCC |
| 值： | 90 件 - 1.0µF ~ 10µF，各 5 件 |
| 包装： | 笔记本 |
| 安装类型： | 表面贴装 |
| 包括封装： | 0402，0603，0805，1206，1210 |
| 产品目录页面： | 2188 (CN2011-ZH PDF) |
| 工具箱内容： | (5) 445-5178-1-ND - CAP CER 4.7UF 6.3V 10% X5R 0603 (5) 445-5175-1-ND - CAP CER 2.2UF 6.3V 10% X5R 0603 (5) 445-4999-1-ND - CAP CER 2.2UF 6.3V 20% X5R 0402 (5) 445-4998-1-ND - CAP CER 1UF 6.3V 10% X5R 0402 (5) 445-4113-1-ND - CAP CER 10UF 6.3V 10% X5R 0805 (5) 445-4112-1-ND - CAP CER 10UF 6.3V 20% X5R 0603 (5) 445-1604-1-ND - CAP CER 1UF 16V 10% X7R 0603 (5) 445-1601-1-ND - CAP CER 10UF 16V 20% X7R 1206 (5) 445-1434-1-ND - CAP CER 10UF 25V 20% X7R 1210 (5) 445-1433-1-ND - CAP CER 4.7UF 25V 10% X7R 1210 更多... |
| 其它名称： | 445-5405 |
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General
Specifications
C Series – General Application
No.
7
8
Item
Temperature
Characteristics
of Capacitance
(Class 1)
Temperature
Characteristics
of Capacitance
(Class 2)
Performance
T.C. Temperature Coefficient
C0G 0 ± 30 (ppm/oC)
Capacitance drift
Within ± 0.2% or ± 0.05pF, whichever
larger.
Capacitance Change (%)
No Voltage Applied
X5R: ± 15%
X7R: ± 15%
X6S: ± 22%
X7S: ± 22%
X7T: +22/-33%
Y5V: + 22/-82%
Test or Inspection Method
Temperature coefficient shall be calculated based on
values at 25oC and 85oC temperature.
Measuring temperature below 20oC shall be -10oC and
-25oC.
Capacitance shall be measured by the steps shown in
the following table after thermal equilibrium is obtained
for each step.
? C be calculated ref. STEP 3 reading
Step Temperature (oC)
1 Reference temp. ± 2
2 Min. operating temp. ± 2
3 Reference temp. ± 2
4
Max. operating temp. ± 2
Measuring voltage: 0.1, 0.2, 0.5, 1.0V rms .
9
Robustness of
Terminations
No sign of termination coming off,
breakage of ceramic, or other abnormal
signs.
Reflow solder the capacitor on P.C. board (shown in
Appendix 1a or Appendix 1b) and apply a pushing
force of 2N (C0603, C1005) or 5N (C1608, C2012,
C3216, C3225, C4532, C5750) for 10 ± 1s.
Pushing force
Capacitor
P.C. board
10
Bending
No mechanical damage.
Reflow solder the capacitor on P.C. board (shown in
Appendix 2a or Appendix 2b) and bend it for 1mm.
20
50
F
R230
1
45
45
Unit: mm
TDK MLCC US Catalog
Page 65
Version B11
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