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参数资料
型号： HI-CV CAP 1004
厂商： TDK Corporation
文件页数： 70/72页
文件大小： 0K
描述： KIT CAP CER HICAP MID VOLTAGE
标准包装： 1
系列： C
套件类型： 通用型，陶瓷 MLCC
值： 160 件 - 1.0µF ~ 47µF，各 10 件
包装： 笔记本
安装类型： 表面贴装
包括封装： 0603，0805，1206，1210，1812，2220
产品目录页面： 2188 (CN2011-ZH PDF)
工具箱内容： (10) 445-1607-1-ND - CAP CER 22UF 25V 20% X7R 1812
(10) 445-1604-1-ND - CAP CER 1UF 16V 10% X7R 0603
(10) 445-1601-1-ND - CAP CER 10UF 16V 20% X7R 1206
(10) 445-1454-1-ND - CAP CER 10UF 50V 20% X7R 2220
(10) 445-1453-1-ND - CAP CER 22UF 25V 20% X7R 2220
(10) 445-1452-1-ND - CAP CER 47UF 16V 20% X5R 2220
(10) 445-1445-1-ND - CAP CER 10UF 25V 20% X7R 1812
(10) 445-1436-1-ND - CAP CER 22UF 16V 20% X5R 1210
(10) 445-1434-1-ND - CAP CER 10UF 25V 20% X7R 1210
(10) 445-1433-1-ND - CAP CER 4.7UF 25V 10% X7R 1210
更多...
其它名称： 445-5407
Soldering
Information
? Recommended Soldering Land Pattern
CSeries–GeneralApplication
? Recommended Soldering Profile
Soldering Natural
Temp
Temp
C
Chip capacitor
Solder land
Peak
Wave Soldering
Soldering
Preheating
Natural
cooling
Peak
Reflow Soldering
Preheating cooling
T
? T
B
A
Solder resist
Over 60 sec.
Wave Soldering
Type C1608
Symbol [CC0603]
A 0.7 - 1.0
B 0.8 - 1.0
C
0.6 - 0.8
C2012
[CC0805]
1.0 - 1.3
1.0 - 1.2
0.8 - 1.1
Unit: mm
C3216
[CC1206]
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
0
0
Over 60 sec. Over 60 sec.
Peak Temp time
Manual soldering
(Solder iron)
300
Peak Temp time
Reflow Soldering
Unit: mm
? T
Symbol
Type
C0603
[CC0201]
C1005
[CC0402]
C1608
[CC0603]
C2012
[CC0805]
A
B
C
0.25 - 0.35
0.2 - 0.3
0.25 - 0.35
0.3 - 0.5
0.35 - 0.45
0.4 - 0.6
0.6 - 0.8
0.6 - 0.8
0.6 - 0.8
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
0
Preheating
3sec. (As short as possible)
250 max.
3 max.
Reflow Soldering
Type C3216
Symbol [CC1206]
A 2.0 - 2.4
B 1.0 - 1.2
C 1.1 - 1.6
C3225
[CC1210]
2.0 - 2.4
1.0 - 1.2
1.9 - 2.5
C4532
[CC1812]
3.1 - 3.7
1.2 - 1.4
2.4 - 3.2
Unit: mm
C5750
[CC2220]
4.1 - 4.8
1.2 - 1.4
4.0 - 5.0
Recommended soldering duration
Temp./ Wave Soldering
Dura. Peak temp Duration
Solder ( ° C) (sec.)
Sn-Pb
Solder
Reflow Soldering
Peak temp Duration
( ° C) (sec.)
230 max. 20 max.
? Recommended Solder Amount
Lead-Free
Solder
260 max.
5 max.
260 max.
10 max.
Excessive
solder
Higher tensile
force on the chip
capacitor may
cause cracking.
Recommended solder compositions
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Preheating Condition
Adequate
solder
Insufficient
solder
TDK MLCC US Catalog
Maximum amoun t
Minimum amount
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
Soldering
Wave
soldering
Reflow
soldering
Manual
soldering
Page 72
Case Size - JIS (EIA)
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
Temp. (oC)
? T ≤ 150
? T ≤ 150
? T ≤ 130
? T ≤ 150
? T ≤ 130
Version B11
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HID 2025 制造商:PEPPERL+FUCHS 功能描述:SINGLE CHANNEL WITH 4-20mA (or 1-5V) ISOLATED OUTPUTS FOR 2-WIRE SMART APPLICATI
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HID 2029 制造商:PEPPERL+FUCHS 功能描述:SINGLE CHANNEL WITH 4-20mA (or 1-5V) ISOLATED OUTPUTS FOR 2/3-WIRE SMART APPLICA
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