参数资料
| 型号： | HI5728INZ |
| 厂商： | Intersil |
| 文件页数： | 11/19页 |
| 文件大小： | 0K |
| 描述： | IC DAC 10BIT PAR 250M 48LQFP |
| 标准包装： | 250 |
| 设置时间： | 35ns |
| 位数： | 10 |
| 数据接口： | 并联 |
| 转换器数目： | 2 |
| 电压电源： | 模拟和数字 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-LQFP |
| 供应商设备封装： | 48-LQFP（7x7） |
| 包装： | 托盘 |
| 输出数目和类型： | * |
| 采样率（每秒）： | 125M |
19
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN4321.5
January 22, 2010
HI5728
Thin Plastic Quad Flatpack Packages (LQFP)
D
D1
E E1
-A-
PIN 1
A2 A1
A
11o-13o
0o-7o
0.020
0.008 MIN
L
0o MIN
PLANE
b
0.004/0.008
0.09/0.20
WITH PLATING
BASE METAL
SEATING
0.004/0.006
0.09/0.16
b1
-B-
e
0.003
0.08
A-B
S
D
S
C
M
0.08
0.003
-C-
-D-
-H-
0.25
0.010
GAGE
PLANE
Q48.7x7A (JEDEC MS-026BBC ISSUE B)
48 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.062
-
1.60
-
A1
0.002
0.005
0.05
0.15
-
A2
0.054
0.057
1.35
1.45
-
b
0.007
0.010
0.17
0.27
6
b1
0.007
0.009
0.17
0.23
-
D
0.350
0.358
8.90
9.10
3
D1
0.272
0.280
6.90
7.10
4, 5
E
0.350
0.358
8.90
9.10
3
E1
0.272
0.280
6.90
7.10
4, 5
L
0.018
0.029
0.45
0.75
-
N48
48
7
e
0.020 BSC
0.50 BSC
-
Rev. 2 1/99
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane
.
4. Dimensions D1 and E1 to be determined at datum plane
.
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm (0.003
inch).
7. “N” is the number of terminal positions.
-C-
-H-
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| HI5728INZ-T | IC DAC 10BIT PAR 250M 48LQFP |
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相关代理商/技术参数 |
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| HI5728INZ-T | 功能描述:数模转换器- DAC W/ANNEAL 10 BIT DL DAC 125MSPS 48 LQFP RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| HI5731 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:12-Bit, 100MSPS, High Speed D/A Converter |
| HI5731_04 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:12-Bit, 100MSPS, High Speed D/A Converter |
| HI5731BIB | 功能描述:IC DAC 12-BIT 100MSPS 28-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率（每秒）:* |
| HI5731BIB-T | 功能描述:DAC 12BIT 100MHZ 5.2V 28-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率（每秒）:* |
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