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参数资料
| 型号： | HI5860IA |
| 厂商： | Intersil |
| 文件页数： | 1/12页 |
| 文件大小： | 0K |
| 描述： | CONV D/A 12BIT 130MSPS 28-TSSOP |
| 标准包装： | 50 |
| 设置时间： | 35ns |
| 位数： | 12 |
| 数据接口： | 并联 |
| 转换器数目： | 1 |
| 电压电源： | 模拟和数字 |
| 功率耗散（最大）： | 200mW |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 28-TSSOP |
| 包装： | 管件 |
| 输出数目和类型： | 2 电流，单极 |
| 采样率（每秒）： | 130M |
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2000, 2005, 2008. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
FN4654.7
HI5860
12-Bit, 130MSPS, High Speed D/A
Converter
The HI5860 is a 12-bit, 130MSPS (Mega Samples Per
Second), high speed, low power, D/A converter which is
implemented in an advanced CMOS process. Operating
from a single +3V to +5V supply, the converter provides
20mA of full scale output current and includes
edge-triggered CMOS input data latches. Low glitch energy
and excellent frequency domain performance are achieved
using a segmented current source architecture.
This device complements the HI5x60 and HI5x28 family of high
speed converters, which includes 8-, 10-, 12-, and 14-bit
devices.
Pinout
HI5860
(28 LD SOIC, TSSOP)
TOP VIEW
Features
Throughput Rate . . . . . . . . . . . . . . . . . . . . . . . . 130MSPS
Low Power . . . 175mW at 5V, 32mW at 3V (At 100MSPS)
Integral Linearity Error (Typ) . . . . . . . . . . . . . . . ±0.5 LSB
Adjustable Full Scale Output Current . . . . . 2mA to 20mA
Internal 1.2V Bandgap Voltage Reference
Single Power Supply from +5V to +3V
Power-Down Mode
CMOS Compatible Inputs
Excellent Spurious Free Dynamic Range
(76dBc, fS = 50MSPS, fOUT = 2.51MHz)
Excellent Multitone Intermodulation Distortion
Pb-Free Available (RoHS Compliant)
Applications
Basestations (Cellular, WLL)
Medical/Test Instrumentation
Wireless Communications Systems
Direct Digital Frequency Synthesis
Signal Reconstruction
High Resolution Imaging Systems
Arbitrary Waveform Generators
28
27
26
25
24
23
22
21
20
19
18
17
16
15
(MSB) D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
(LSB) D0
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CLK
DCOM
ACOM
AVDD
COMP2
IOUTB
COMP1
FSADJ
REFIO
REFLO
SLEEP
DVDD
IOUTA
ACOM
Ordering Information
PART
NUMBER
PART MARKING
TEMP. RANGE (°C)
PACKAGE
PKG. DWG. #
CLOCK SPEED
HI5860IA*
HI5860 IA
-40 to +85
28 Ld TSSOP
M28.173
130MHz
HI5860IB
-40 to +85
28 Ld SOIC
M28.3
130MHz
HI5860IBZ*
(Note)
HI5860IBZ
-40 to +85
28 Ld SOIC (Pb-free)
M28.3
130MHz
HI5860SOICEVAL1
+25
Evaluation Platform
130MHz
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
Data Sheet
February 6, 2008
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相关代理商/技术参数 |
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|---|---|
| HI5860IA-T | 功能描述:CONV D/A 12BIT 130MSPS 28-TSSOP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率（每秒）:* |
| HI5860IB | 功能描述:CONV D/A 12-BIT 130MSPS 28-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率（每秒）:* |
| HI5860IBZ | 功能描述:数模转换器- DAC 12-BIT D/A 130MSPS 2 8LD IND TEMP RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| HI5860IBZ-T | 功能描述:数模转换器- DAC 12-BIT D/A 130MSPS 2 8LD IND TEMP RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| HI5860S0ICEVALI | 制造商:Harris Corporation 功能描述: |
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