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参数资料
| 型号： | HI9P0201HS-5 |
| 厂商： | INTERSIL CORP |
| 元件分类： | 运动控制电子 |
| 英文描述： | Header; No. of Contacts:50; Pitch Spacing:0.079"; No. of Rows:2; Gender:Male; Series:1552; Body Material:Glass Filled Polyester; Connector Retention Style:Latch/Ejector; Contact Termination:Through Hole; Housing Style:Right-Angle RoHS Compliant: Yes |
| 中文描述： | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 |
| 封装： | SOIC-16 |
| 文件页数： | 11/11页 |
| 文件大小： | 253K |
| 代理商： | HI9P0201HS-5 |
11
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
Die Characteristics
DIE DIMENSIONS:
2440
μ
m x 2860
μ
m x 485
μ
m
METALLIZATION:
Type: CuAl
Thickness: 16k
±
2k
PASSIVATION:
Type: Nitride Over Silox
Nitride Thickness: 3.5k
±
1k
Silox Thickness: 12k
±
2k
WORST CASE CURRENT DENSITY:
9.5 x 10
4
A/cm
2
Metallization Mask Layout
HI-201HS
A1
A2
OUT2
IN2
V+
IN3
OUT3
A3
A4
OUT4
IN4
GND
V-
IN1
OUT1
HI-201HS
相关PDF资料 |
PDF描述 |
|---|---|
| HI9P0201HS-5Z | Header; No. of Contacts:50; Pitch Spacing:0.079"; No. of Rows:2; Gender:Male; Series:1552; Body Material:Glass Filled Polyester; Connector Retention Style:Latch/Ejector; Contact Termination:Through Hole; Housing Style:Right-Angle RoHS Compliant: Yes |
| HI9P0201HS-9 | Header; No. of Contacts:50; Pitch Spacing:0.079"; No. of Rows:2; Gender:Male; Series:1552; Body Material:Glass Filled Polyester; Connector Retention Style:Latch/Ejector; Contact Termination:Through Hole; Housing Style:Right-Angle RoHS Compliant: Yes |
| HI9P0201HS-9Z | Header; No. of Contacts:50; Pitch Spacing:0.079"; No. of Rows:2; Gender:Male; Series:1552; Body Material:Glass Filled Polyester; Connector Retention Style:Latch/Ejector; Contact Termination:Through Hole; Housing Style:Right-Angle RoHS Compliant: Yes |
| HI9P0201-5 | Dual/Quad SPST, CMOS Analog Switches |
| HI9P0201-9 | Dual/Quad SPST, CMOS Analog Switches |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HI9P0201HS-5Z | 功能描述:模拟开关 IC SWITCH 4X SPST N C 16W COM RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| HI9P0201HS-9 | 功能描述:IC SWITCH QUAD SPST 16SOIC RoHS:否 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 标准包装:48 系列:- 功能:开关 电路:4 x SPST - NO 导通状态电阻:100 欧姆 电压电源:单/双电源 电压 - 电源，单路/双路(±):2 V ~ 12 V，±2 V ~ 6 V 电流 - 电源:50nA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:管件 |
| HI9P0201HS-9Z | 功能描述:模拟开关 IC SWITCH 4X SPST N C 16W IND RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| HI9P0222-9 | 制造商:Harris Corporation 功能描述: |
| HI9P-0222-9 WAF | 制造商:Harris Corporation 功能描述: |
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