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参数资料
| 型号： | HI9P0301-5 |
| 厂商： | INTERSIL CORP |
| 元件分类： | 运动控制电子 |
| 英文描述： | CMOS Analog Switches |
| 中文描述： | 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO14 |
| 封装： | PLASTIC, MS-012AB, SOIC-14 |
| 文件页数： | 10/11页 |
| 文件大小： | 117K |
| 代理商： | HI9P0301-5 |
10
HI-301 thru HI-307
Ceramic Dual-In-Line Frit Seal Packages (CERDIP)
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. This dimension allows for off-center lid, meniscus, and glass
overrun.
6. Dimension Q shall be measured from the seating plane to the
base plane.
7. Measure dimension S1 at all four corners.
8. N is the maximum number of terminal positions.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
bbb
C A - B
S
c
Q
L
A
SEATING
PLANE
BASE
PLANE
D
-D-
-A-
-C-
-B-
α
D
E
S1
b2
b
A
e
M
c1
b1
(c)
(b)
SECTION A-A
BASE
METAL
LEAD FINISH
e
A/2
A
M
S
S
ccc
C A - B
M
D
S
S
aaa
C A - B
M
D
S
S
e
A
F14.3
MIL-STD-1835 GDIP1-T14 (D-1, CONFIGURATION A)
14 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.200
-
5.08
-
b
0.014
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
0.785
-
19.94
5
E
0.220
0.310
5.59
7.87
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
-
eA/2
0.150 BSC
3.81 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
6
S1
α
aaa
0.005
90
o
-
0.13
90
o
-
7
105
o
105
o
-
-
0.015
-
0.38
-
bbb
-
0.030
-
0.76
-
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2, 3
N
14
14
8
Rev. 0 4/94
相关PDF资料 |
PDF描述 |
|---|---|
| HI9P0303-5 | CMOS Analog Switches |
| HI9P0303-9 | CMOS Analog Switches |
| HI-301 | 32 MCELL 3 VOLT ZERO POWER ISP CPLD - NOT RECOMMENDED for NEW DESIGN |
| HI-303 | CMOS Analog Switches |
| HI-307 | 32 MCELL 3 VOLT ZERO POWER ISP CPLD - NOT RECOMMENDED for NEW DESIGN |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HI9P0302-5 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HI9P0302-5 WAF | 制造商:Harris Corporation 功能描述: |
| HI9P0302-9 WAF | 制造商:Harris Corporation 功能描述: |
| HI9P0303-5 | 制造商:Rochester Electronics LLC 功能描述:SWITCH 2X DPST N.B. 14SOIC COM - Bulk |
| HI9P0303-9 | 功能描述:IC SWITCH DUAL SPDT 14SOIC RoHS:否 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 标准包装:48 系列:- 功能:开关 电路:4 x SPST - NO 导通状态电阻:100 欧姆 电压电源:单/双电源 电压 - 电源，单路/双路(±):2 V ~ 12 V，±2 V ~ 6 V 电流 - 电源:50nA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:管件 |
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