参数资料
| 型号： | HIN211EIBZ |
| 厂商： | Intersil |
| 文件页数： | 11/22页 |
| 文件大小： | 0K |
| 描述： | IC 4DRVR/5RCVR RS232 5V 28-SOIC |
| 标准包装： | 1,040 |
| 类型： | 收发器 |
| 驱动器/接收器数： | 4/5 |
| 规程： | RS232 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 28-SOIC W |
| 包装： | 管件 |
19
FN4315.16
November 4, 2005
HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm
(0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H
0.25(0.010)
B
M
α
0.25
0.010
GAUGE
PLANE
A2
M24.209 (JEDEC MO-150-AG ISSUE B)
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.312
0.334
7.90
8.50
3
E
0.197
0.220
5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
N24
24
7
α
0o
8o
0o
8o
-
Rev. 1
3/95
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HIN211IA | 制造商:Harris Corporation 功能描述: 制造商:Intersil Corporation 功能描述: |
| HIN211IA WAF | 制造商:Intersil Corporation 功能描述: |
| HIN211IA-T | 制造商:未知厂家 制造商全称:未知厂家 功能描述:LINE TRANSCEIVER|CMOS|4 DRIVER|5 RCVR|SSOP|28PIN|PLASTIC |
| HIN211IB | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HIN211IB-T | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Interface IC |
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