参数资料
| 型号： | HIN232CBZ-T |
| 厂商： | Intersil |
| 文件页数： | 15/21页 |
| 文件大小： | 0K |
| 描述： | IC 2DRVR/2RCVR RS232 5V 16-SOIC |
| 标准包装： | 1,000 |
| 类型： | 收发器 |
| 驱动器/接收器数： | 2/2 |
| 规程： | RS232 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 16-SOIC |
| 包装： | 带卷 (TR) |
3
FN3138.16
September 26, 2008
Ordering Information
PART
NUMBER
PART
MARKING
TEMP. RANGE
(°C)
PACKAGE
PKG.
DWG. #
HIN232CB*
232CB
0 to +70
16 Ld SOIC
M16.3
HIN232CBZ*
(Note)
HIN232CBZ
0 to +70
16 Ld SOIC
(Pb-free)
M16.3
HIN232CP
0 to +70
16 Ld PDIP
E16.3
HIN232CPZ
(Note)
HIN232CPZ
0 to +70
16 Ld PDIP**
(Pb-free)
E16.3
HIN232IB*
HIN232IB
-40 to +85
16 Ld SOIC
M16.3
HIN232IBZ*
(Note)
HIN232IBZ
-40 to +85
16 Ld SOIC
(Pb-free)
M16.3
HIN232IP
-40 to +85
16 Ld PDIP
E16.3
HIN232IPZ
(Note)
HIN232IPZ
-40 to +85
16 Ld PDIP**
(Pb-free)
E16.3
HIN236CB
0 to +70
24 Ld SOIC
M24.3
HIN236CBZ
(Note)
HIN236CBZ
0 to +70
24 Ld SOIC
(Pb-free)
M24.3
HIN237CB*
HIN237CB
0 to +70
24 Ld SOIC
M24.3
HIN237CBZ*
(Note)
HIN237CBZ
0 to +70
24 Ld SOIC
(Pb-free)
M24.3
HIN238CB*
HIN238CB
0 to +70
24 Ld SOIC
M24.3
HIN238CBZ*(Note)
HIN238CBZ
0 to +70
24 Ld SOIC
(Pb-free)
M24.3
HIN238CP
0 to +70
24 Ld PDIP
E24.3
HIN238IB
-40 to +85
24 Ld SOIC
M24.3
HIN238IBZ
(Note)
HIN238IBZ
-40 to +85
24 Ld SOIC
(Pb-free)
M24.3
HIN239CB*
HIN239CB
0 to +70
24 Ld SOIC
M24.3
HIN239CBZ*
(Note)
HIN239CBZ
0 to +70
24 Ld SOIC
(Pb-free)
M24.3
HIN239CP
0 to +70
24 Ld PDIP
E24.3
HIN239CPZ
(Note)
HIN239CPZ
0 to +70
24 Ld PDIP**
(Pb-free)
E24.3
HIN240CN
0 to +70
44 Ld MQFP
Q44.10X10
HIN240CNZ*
(Note)
HIN240CNZ
0 to +70
44 Ld MQFP
(Pb-free)
Q44.10X10
HIN241CA
0 to +70
28 Ld SSOP
M28.209
HIN241CAZ
(Note)
HIN241CAZ
0 to +70
28 Ld SSOP
(Pb-free)
M28.209
HIN241CB*
HIN241CB
0 to +70
28 Ld SOIC
M28.3
HIN241CBZ*
(Note)
HIN241CBZ
0 to +70
28 Ld SOIC
(Pb-free)
M28.3
HIN241IB
-40 to +85
28 Ld SOIC
M28.3
HIN241IBZ
(Note)
HIN241IBZ
-40 to +85
28 Ld SOIC
(Pb-free)
M28.3
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
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相关代理商/技术参数 |
参数描述 |
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| HIN232CJ | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Harris Corporation 功能描述: |
| HIN232CP | 功能描述:IC TXRX RS-232 5V 16-PDIP RoHS:否 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.295"，7.50mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| HIN232CPZ | 功能描述:RS-232接口集成电路 RS232 5V 2D/2R 1UF CAPS COM RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: |
| HIN232E | 制造商:未知厂家 制造商全称:未知厂家 功能描述:+/-15kV. ESD-Protected. +5V Powered. RS-232 Transmitters/Receivers |
| HIN232ECA | 制造商:Rochester Electronics LLC 功能描述:RS232 5V 2D/2R 15KV 0.1UF CAP 16SSOP COM - Bulk 制造商:Harris Corporation 功能描述: 制造商:Intersil Corporation 功能描述: |
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