参数资料
型号: HIN232ECBZ-T
厂商: Intersil
文件页数: 10/22页
文件大小: 0K
描述: IC 2DRVR/2RCVR RS232 5V 16-SOIC
标准包装: 1,000
类型: 收发器
驱动器/接收器数: 2/2
规程: RS232
电源电压: 4.5 V ~ 5.5 V
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.295",7.50mm 宽)
供应商设备封装: 16-SOIC
包装: 带卷 (TR)
18
FN4315.16
November 4, 2005
HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010)
B
M
α
M16.3 (JEDEC MS-013-AA ISSUE C)
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.3977
0.4133
10.10
10.50
3
E
0.2914
0.2992
7.40
7.60
4
e
0.050 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N16
16
7
α
-
Rev. 1 6/05
相关PDF资料
PDF描述
IDT72T1855L5BBI IC FIFO 4096X18 2.5V 5NS 144BGA
MAX1111EEE/V+ IC ADC 8BIT 8CH LP 16QSOP
IDT72T1855L4-4BB IC FIFO 4096X18 2.5V 4NS 144BGA
V48B28M250BF3 CONVERTER MOD DC/DC 28V 250W
IDT72V265LA20PF IC FIFO SS 16384X18 20NS 64-TQFP
相关代理商/技术参数
参数描述
HIN232ECP 功能描述:IC TXRX RS-232 5V ESD 16-PDIP RoHS:否 类别:集成电路 (IC) >> 接口 - 驱动器,接收器,收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC(0.295",7.50mm 宽) 供应商设备封装:16-SOIC 包装:带卷 (TR)
HIN232ECPZ 功能描述:RS-232接口集成电路 RS232 5V 2D/2R 15KV 0.1UF 16WPDIP COM RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装:
HIN232EIBN 功能描述:IC 2DRVR/2RCVR RS232 5V 16-SOIC RoHS:否 类别:集成电路 (IC) >> 接口 - 驱动器,接收器,收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC(0.295",7.50mm 宽) 供应商设备封装:16-SOIC 包装:带卷 (TR)
HIN232EIBN-T 功能描述:IC 2DRVR/2RCVR RS232 5V 16-SOIC RoHS:否 类别:集成电路 (IC) >> 接口 - 驱动器,接收器,收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC(0.295",7.50mm 宽) 供应商设备封装:16-SOIC 包装:带卷 (TR)
HIN232EIBNZ 功能描述:RS-232接口集成电路 RS232 5V 2D/2R 15KV 0 1UF 16N COM RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: