参数资料
型号: HIN232EIBNZ
厂商: Intersil
文件页数: 15/22页
文件大小: 0K
描述: IC 2DRVR/2RCVR RS232 5V 16-SOIC
标准包装: 480
类型: 收发器
驱动器/接收器数: 2/2
规程: RS232
电源电压: 4.5 V ~ 5.5 V
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.154",3.90mm 宽)
供应商设备封装: 16-SOIC
包装: 管件
22
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN4315.16
November 4, 2005
HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H
0.25(0.010)
B
M
α
M28.3 (JEDEC MS-013-AE ISSUE C)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.6969
0.7125
17.70
18.10
3
E
0.2914
0.2992
7.40
7.60
4
e
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.01
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N28
28
7
α
0o
8o
0o
8o
-
Rev. 0 12/93
相关PDF资料
PDF描述
MS27474T14F35P EDR CONN RCPT 37POS JAM NUT W/PINS
MAX1077ETC+T IC ADC 10BIT 1.5MSPS 12-TQFN
V72B24M250B2 CONVERTER MOD DC/DC 24V 250W
IDT72T3645L4-4BB IC FIFO 1024X36 4-4NS 208-BGA
MAX1078ETC+T IC ADC 10BIT 1.8MSPS 12-TQFN
相关代理商/技术参数
参数描述
HIN232EIBNZ-T 功能描述:RS-232接口集成电路 RS232 5V 2D/2R 15KV 0 1UF 16N COM RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装:
HIN232EIV 功能描述:IC 2DRVR/2RCVR RS232 5V 16-TSSOP RoHS:否 类别:集成电路 (IC) >> 接口 - 驱动器,接收器,收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC(0.295",7.50mm 宽) 供应商设备封装:16-SOIC 包装:带卷 (TR)
HIN232EIV-T 功能描述:IC 2DRVR/2RCVR RS232 5V 16-TSSOP RoHS:否 类别:集成电路 (IC) >> 接口 - 驱动器,接收器,收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC(0.295",7.50mm 宽) 供应商设备封装:16-SOIC 包装:带卷 (TR)
HIN232EIVZ 功能描述:RS-232接口集成电路 RS232 5V 2D/2R 15KV 0 1UF COM RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装:
HIN232EIVZ-T 功能描述:RS-232接口集成电路 RS232 5V 2D/2R 15KV 0 1UF COM RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: