参数资料
| 型号： | HIN239CP |
| 厂商： | Intersil |
| 文件页数： | 21/21页 |
| 文件大小： | 0K |
| 描述： | IC 3DRVR/5RCV RS232 5/12V 24-DIP |
| 标准包装： | 15 |
| 类型： | 收发器 |
| 驱动器/接收器数： | 3/5 |
| 规程： | RS232 |
| 电源电压： | 5 V，7.5 V ~ 13.2 V |
| 安装类型： | 通孔 |
| 封装/外壳： | 24-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 24-PDIP |
| 包装： | 管件 |
9
FN3138.16
September 26, 2008
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < VCC < 6V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)
ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
Operating Conditions
Temperature Range
HIN2xxcx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
HIN2xxIx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Thermal Resistance (Typical, Note 3)
θJC (°C/W)
16 Ld PDIP Package*
90
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
70
16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
100
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
75
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
95
44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . .
80
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . -65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . see link below
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
2. Only HIN239. For V+ > 11V, C1 must be
≤0.1F.
3.
θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range
PARAMETER
TEST CONDITIONS
MIN
(Note 5)
TYP
MAX
(Note 5)
UNITS
SUPPLY CURRENTS
Power Supply Current, ICC
No Load,
TA = +25°C
HIN232
-
5
10
mA
HIN236-HIN238, HIN240-HIN241
-
7
15
mA
HIN239
-
0.4
1
mA
V+ Power Supply Current, ICC
No Load, TA = +25°C
No Load,
TA = +25°C
HIN239
-
5.0
15
mA
Shutdown Supply Current, ICC(SD)
TA = +25°C
-
1
10
A
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, VlL
TIN, EN, Shutdown
-
0.8
V
Input Logic High, VlH
TIN
2.0
-
V
EN, Shutdown
2.4
-
V
Transmitter Input Pull-up Current, IP
TIN = 0V
-
15
200
A
TTL/CMOS Receiver Output Voltage Low, VOL
IOUT = 1.6mA
-
0.1
0.4
V
TTL/CMOS Receiver Output Voltage High, VOH
IOUT = -1.0mA
3.5
4.6
-
V
RECEIVER INPUTS
RS-232 Input Voltage Range VIN
-30
-
+30
V
Receiver Input Impedance RIN
VIN = ±3V
3.0
5.0
7.0
k
Ω
Receiver Input Low Threshold, VlN (H-L)
VCC = 5V, TA = +25°C
0.8
1.2
-
V
Receiver Input High Threshold, VIN (L-H)
VCC = 5V, TA = +25°C
-
1.7
2.4
V
Receiver Input Hysteresis VHYST
0.2
0.5
1.0
V
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
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