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参数资料
| 型号： | HIP0050IB |
| 厂商： | INTERSIL CORP |
| 元件分类： | Peripheral Driver |
| 英文描述： | 0.3 A BUF OR INV BASED PRPHL DRVR, PDSO24 |
| 封装： | PLASTIC, MS-013-AD, SOIC-24 |
| 文件页数： | 4/7页 |
| 文件大小： | 156K |
| 代理商： | HIP0050IB |
4
HIP0050
FIGURE 1. LOGIC TIMING CONTROL WAVEFORMS
Pulse Width Low
tW(SCKL)
-
27
175
ns
SERIAL DATA IN (SI) (Refer to Figure 1 for Waveform Detail)
Input Setup Time
tSUI
-1.1
75
ns
Input Hold Time
THI
-1.5
75
ns
STROBE (STR)
Strobe Pulse Width
tW(S)
-
12
150
ns
Clock to Strobe Delay
tD(CS)
-5
75
ns
SERIAL DATA OUT (SO) (Refer to Figure 1 for Waveform Detail)
Low Level Output Voltage
VOL
Sink Current = 1.6mA
-
0.2
0.4
V
High Level Output Voltage
VOH
Source Current = -1.6mA
3.7
4.4
-
V
Propagation Delay
tP(CD)
75
260
500
ns
PROTECTION PARAMETERS
Fault Output (FLT) Low
VOL
Sink Current = 1.6mA
-
0.4
V
Over-Temp. (OT) Shutdown
TSD
145
155
165
oC
OT Shutdown Hysteresis
TH
510
20
oC
NOTES:
1. The MOSFET Output Drain is internally clamped with a Drain-to-Gate Zener Diode that turns on the MOSFET; holding the drain at the
output clamp voltage VOC.
2. The HIP0050 Output Drive is protected by an internal current shutdown. The ICL over-current shutdown threshold parameter specification
defines the maximum current. The minimum limit for this threshold is 300mA. The maximum current with all outputs ON may be further
limited by dissipation.
3. Package dissipation is based on thermal resistance capability in a normal operating environment. The junction to ambient thermal resis-
tance values are defined here as a PC Board mounted device with minimal copper. Due to the heat conducting capability of the DIP and
SOIC package lead frames, 35
oC/W thermal resistance can be achieved with approximately 2 square inches of 1 oz. copper PC Board
area. The junction to lead thermal resistance values are based on measurements from the chip to the ground leads of the package.
Electrical Specifications
VCC = 4.5V to 5.5V, VBATT = 8V to 16V, TA = -40
oC to 85oC; Unless Otherwise Specified (Continued)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SCK (CLOCK)
SI (SERIAL DATA IN)
STR (STROBE)
DRx (POWER OUTPUT DRIVER)
SO (SERIAL DATA OUT)
tW(SCK)
t SUI
tHI
tD(CS)
tW(S)
tD(LH)
tD(HL)
t P(CD)
tFALL, tRISE
10%
90%
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