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参数资料
| 型号： | HIP1011BCB |
| 厂商： | Intersil |
| 文件页数： | 9/9页 |
| 文件大小： | 237K |
| 描述： | IC CTRLR HOT PLUG PCI 16-SOIC |
| 标准包装： | 48 |
| 类型： | 热交换控制器 |
| 应用： | 通用型 CompactPCI? |
| 内部开关： | 无 |
| 电源电压： | 10.8 V ~ 13.2 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-SOIC |
| 包装： | 管件 |
9
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporations quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN4640.5
November 18, 2004
HIP1011B
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the MO Series Symbol List in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension D does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension E does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. L is the length of terminal for soldering to a substrate.
7. N is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width B , as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
INDEX
AREA
E
D
N
1 2 3
-B-
0.25(0.010)
C A
M
B
S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
?/DIV>
0.25(0.010)
B
M
M
?/DIV>
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.053
0.069
1.35
1.75
-
A1
0.004
0.010
0.10
0.25
-
B
0.014
0.019
0.35
0.49
9
C
0.007
0.010
0.19
0.25
-
D
0.386
0.394
9.80
10.00
3
E
0.150
0.157
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.228
0.244
5.80
6.20
-
h
0.010
0.020
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
16
16
7
?/DIV>
0
o
8
o
0
o
8
o
-
Rev. 1 02/02
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相关代理商/技术参数 |
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| HIP1011BCB-T | 功能描述:IC CTRLR HOT PLUG PCI 16-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:100 系列:- 类型:热插拔开关 应用:通用 内部开关:是 电流限制:可调 电源电压:9 V ~ 13.2 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-TDFN-EP（3x3） 包装:管件 |
| HIP1011BCBZA | 功能描述:热插拔功率分布 W/ANNEAL PCI HOT PLUG PWR CNTRLR RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
| HIP1011BCBZA-T | 功能描述:热插拔功率分布 W/ANNEAL PCI HOT PLUG PWR CNTRLR RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
| HIP1011CB | 功能描述:IC CTRLR HOT PLUG PCI 16-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:100 系列:- 类型:热插拔开关 应用:通用 内部开关:是 电流限制:可调 电源电压:9 V ~ 13.2 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-TDFN-EP（3x3） 包装:管件 |
| HIP1011CB-T | 功能描述:IC CTRLR HOT PLUG PCI 16-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:100 系列:- 类型:热插拔开关 应用:通用 内部开关:是 电流限制:可调 电源电压:9 V ~ 13.2 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-TDFN-EP（3x3） 包装:管件 |
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