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参数资料
| 型号： | HIP1011DCA |
| 厂商： | Intersil |
| 文件页数： | 8/15页 |
| 文件大小： | 0K |
| 描述： | IC CTRLR HOTPLUG PCI DUAL 28SSOP |
| 标准包装： | 48 |
| 类型： | 热交换控制器 |
| 应用： | 通用型 CompactPCI? |
| 内部开关： | 无 |
| 电源电压： | 10.8 V ~ 13.2 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-SSOP（0.154"，3.90mm 宽） |
| 供应商设备封装： | 28-SSOP/QSOP |
| 包装： | 管件 |
HIP1011D, HIP1011E
TABLE 1.
discharge the load when disabled. Upon turn-off these
SUPPLY
+3.3V I OC
+5.0V I OC
+12V I OC
-12V I OC
HOW TO DETERMINE +25c NOMINAL ( ± 10%) I OC
FOR EACH SUPPLY
((100 μ A x R OCSET )/11.5)/R RSENSE
((100 μ A x R OCSET )/14.5)/R RSENSE
(100 μ A x R OCSET )/1
(100 μ A x R OCSET )/3.4
internal switches on each output discharge the load
capacitance pulling the output to GND. These switches are
also on when PWRON is low thus an open slot is held at the
GND level.
Decoupling Precautions and Recommendations
For the HIP1011D/E proper decoupling is a particular
concern during the normal switching operation and
Time Delay to Latch-Off
Time delay to latch-off allows for a predetermined delay from
an OC or UV in the HIP1011D or an OC in the HIP1011E
event to the simultaneous latch-off of all four supply switches
of the affected slot. This delay period is set by the
capacitance value to ground from the FLTN pins for each
slot. This capacitance value tailors the FLTN signal going low
ramp rate. This provides a delay to the fault signal latch-off
threshold voltage, FLTN, Vth. By increasing this time, the
HIP1011D/E delays immediate latch-off of the bus supply
switches, thus ignoring transient faults. See additional
information in the “Using the HIP1011DEVAL1 Platform”
section of this data sheet. The HIP1011E has all features of
the HIP1011D but it does not respond to UV events.
Caution: The primary purpose of a protection device such
as the HIP1011D/E is to quickly isolate a faulted card from
the voltage bus. Delaying the time to latch-off works against
this primary concern so care must be taken when using this
feature. Ensure adequate sizing of external FETs to carry
additional current during time out period. Understand that
especially during a card crowbar failure. If a card
experiences a crow bar short to ground, the supply to the
other card will experience transients until the faulted card is
isolated from the bus. In addition the common IC nodes
between the two sides can fluctuate unpredictably resulting
in a false latch-off of the second slot. Additionally to the
mother board bulk capacitance, it is recommended that 10 μ F
capacitors be placed on both the +12V and -12V lines of the
HIP1011D/E as close to the chip as possible.
Recommended PCB Layout Design Best Practices
To ensure accurate current sensing, PCB traces that
connect each of the current sense resistors to the
HIP1011D/E must not carry any load current. This can be
accomplished by two dedicated PCB kelvin traces directly
from the sense resistors to the HIP1011D/E (see examples
of correct and incorrect layouts below in Figure 3). To reduce
parasitic inductance and resistance effects, maximize the
width of the high-current PCB traces.
voltage bus disruptions must be minimized for the time delay
period in the event of a crow bar failure.
Devices using an unadjustable preset delay to latch-off time
present the user with the inability to eliminate these
concerns increasing cost and the chance of additional ripple
through failures.
HIP1011D, HIP1011E Soft Start and Turn-Off
Considerations
The HIP1011D/E does allow the user to select the rate of
ramp up on the voltage supplies. This startup ramp
minimizes in-rush current at startup while the on card bulk
CORRECT
TO HIP1011D/E
VS AND VISEN
INCORRECT
TO HIP1011D
VS AND VISEN
CURRENT
SENSE RESISTOR
capacitors charge. The ramp is created by placing
capacitors on M12VG to M12VO, 12VG to 12VO and 3V5VG
to ground. These capacitors are each charged up by a
nominal 25 μ A current during turn on. The same value for all
gate timing capacitors is recommended. A recommended
minimum value of 0.033 μ F as a smaller value may cause
overcurrent faults at power up. This recommendation results
in a nominal gate voltage ramp rate of 0.76V/ms. The gate
capacitors must be discharged when a fault is detected to
turn off the power FETs. Thus, larger caps slow the response
time. If the gate capacitors are too large the HIP1011D/E
may not be able to adequately protect the bus or the power
FETs. The HIP1011D/E have internal discharge FETs to
8
FIGURE 3. SENSE RESISTOR PCB LAYOUT
FN4725.5
November 18, 2004
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HIP1011DCA-T | 功能描述:IC CTRLR HOTPLUG PCI DUAL 28SSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:100 系列:- 类型:热插拔开关 应用:通用 内部开关:是 电流限制:可调 电源电压:9 V ~ 13.2 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-TDFN-EP（3x3） 包装:管件 |
| HIP1011DCAZA | 功能描述:热插拔功率分布 W/ANNEAL DL VER OF HIP1011 2 8LD SSOP RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
| HIP1011DCAZA-T | 功能描述:热插拔功率分布 W/ANNEAL DL PCI HOT PLUG PWR CNTRLR RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
| HIP1011DEVAL1 | 功能描述:电源管理IC开发工具 DL SLOT PCI HOT PLUG EVALUATION BRD RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| HIP1011E | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Dual Slot PCI Hot Plug Controller |
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