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参数资料
| 型号： | HIP1030AS |
| 厂商： | INTERSIL CORP |
| 元件分类： | Peripheral Driver |
| 英文描述： | 1.6 A BUF OR INV BASED PRPHL DRVR, PSFM5 |
| 封装： | PLASTIC, TS-001AA, SIP-5 |
| 文件页数： | 3/7页 |
| 文件大小： | 117K |
| 代理商： | HIP1030AS |
3
Absolute Maximum Ratings
Thermal Information
Maximum Supply Voltage VCC. . .See O.V. Shutdown Limit, VOVSD
Input Voltage, VIN (Note 1). . . . . . . . . . . . . . . . . -1V to (VCC - 0.5V)
Load Current, IOUT . . . . . . . . . . . . . . . . . . . . . . . . . Internal Limiting
Load Dump (Survival) . . . . . . . . . . . . . . . . . . . . . . . . . .
±60VPEAK
Reverse Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -16V
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 125oC
Thermal Resistance (Typical, Note 2)
θJA (oC/W) θJC (oC/W)
Plastic SIP Package . . . . . . . . . . . . . .
50
4
Maximum Power Dissipation (Note 3)
At TA = 125
oC, Infinite Heat Sink . . . . . . . . . . . . . . . . . . . . 6.25W
Maximum Junction Temperature, TJ. . . . . . . . . . . . . . . . . . . . 150
oC
Maximum Storage Temperature Range . . . . . . . . . . -40oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC
(Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. The Input Control Voltage, VIN shall not be greater than (VCC - 0.5V) and shall not exceed +7V when VCC is greater than 7.5V.
2.
θJA is measured with the component mounted on an evaluation PC board in free air.
3. The worst case thermal resistance,
θJC for the SIP TS-001AA 5 lead package is 4oC/W. The calculation for dissipation and junction
temperature rise due to dissipation is:
PD = (VCC-VOUT)(IOUT) + (VCC)(ICCMAX - IOUT) or (VCC)(ICCMAX) - (VOUT)(IOUT)
TJ = TAMBIENT + (PD) (θJC) for an infinite Heat Sink.
Refer to Figure 1 for Derating based on Dissipation and Thermal Resistance. Derating from 150oC is based on the reciprocal of thermal
resistance,
θJC + θHS. For example: Where θJC = 4oC/W and given θHS = 6oC/W as the thermal resistance of an external Heat Sink,
the junction-to-air thermal resistance,
θJA = 10oC/W. Therefore, for the maximum allowed dissipation, derate 0.1W/oC for each degree
from TAMB to the maximum rated junction temperature of 150
oC. If T
AMB = 100
oC, the maximum P
D is (150 - 100) x 0.1W/
oC = 5W.
Electrical Specifications
TA = -40
oC to 125oC, V
IN = 2V, VCC = +12V, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Operating Voltage Range
VCC
4.5
-
25
V
Over-Voltage Shutdown
VOVSD
RL = 1K; VIN = 2V
26
33
38
V
Over-Temperature Limiting
TSD
-150
-
oC
Negative Pulse
Output Clamp Voltage
VCL
ICL = -100mA; VCC = 4.5V to 25V
(VCC - 35) (VCC - 30.5)
(VCC - 28)
V
Short Circuit Current Limiting
ISC
(Note 4)
1.1
1.6
2.5
A
Input Control ON
VIH
2.0
-
V
Input Control OFF
VIL
--
0.8
V
Input Current High
IIH
VIN = 5.5V, VCC = 6V to 24V
6
-
40
A
Input Current Low
IIL
VIN = 0.8V, VCC = 6V to 24V
6
-
30
A
Supply Current, Full Load
Input Control ON
ICCMAX
VIN = 2V; IOUT = 1.0A;
-
1.05
1.1
A
Supply Current, No Load
Input Control OFF
ICCMIN
VIN = 0V; IOUT = 0A;
-
55
100
A
Input-Output Forward Voltage
Drop (VCC - VOUT)
VSAT
IOUT = 1A; VCC = 4.5V to 25V
-
0.6
1
V
Output Leakage
IOUT_LK
VIN = 0.8V; VCC = 6V to 24V
-
4
50
A
Turn ON Time
tON
RL = 80; (Note 5)
-
5
20
s
Turn OFF Time
tOFF
RL = 80; (Note 5)
-
25
65
s
NOTES:
4. Short circuit current will be reduced when thermal shutdown occurs. Testing of short circuit current may require a short duration pulse.
See Figure 7.
5. Refer to Figures 3A and 3B for typical switching speeds with a 20
Load.
HIP1030
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