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参数资料
| 型号： | HIP2123FRTBZ-T |
| 厂商： | Intersil |
| 文件页数： | 14/16页 |
| 文件大小： | 0K |
| 描述： | IC INTERFACE |
| 标准包装： | 6,000 |
| 系列： | * |
HIP2122, HIP2123
Depending on the amount of power dissipated by the HIP2122/23,
EPAD
GND
PLANE
FIGURE 24. PCB VIA PATTERN
COMPONENT
LAYER
EPAD
GND
PLANE
BOTTOM
LAYER
it may be necessary, to connect the EPAD to one or more ground
plane layers. A via array, within the area of the EPAD, will conduct
heat from the EPAD to the GND plane on the bottom layer. If inner
PCB layers are available, it is also be desirable to connect these
additional layers with the plated-through vias.
The number of vias and the size of the GND planes required for
adequate heatsinking is determined by the power dissipated by
the HIP2122/23, the air flow, and the maximum temperature of
the air around the IC.
It is important that the vias have a low thermal resistance for
efficient heat transfer. Do not use “thermal relief” patterns to
FIGURE 24. TYPICAL PCB PATTERN FOR THERMAL VIAS
connect the vias.
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest revision.
DATE
December 23, 2011
REVISION
FN7670.0
Initial Release
CHANGE
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products
address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.
Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a
complete list of Intersil product families.
For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on
intersil.com: HIP2122, HIP2123
To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff
FITs are available from our website at: http://rel.intersil.com/reports/sear
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
14
FN7670.0
December 23, 2011
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