参数资料
型号: HIP4082IBT
厂商: Intersil
文件页数: 11/12页
文件大小: 0K
描述: IC DRIVER H-BRIDGE 16-SOIC
标准包装: 2,500
配置: 半桥
输入类型: 非反相
延迟时间: 75ns
电流 - 峰: 1.4A
配置数: 1
输出数: 4
高端电压 - 最大(自引导启动): 95V
电源电压: 8.5 V ~ 15 V
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.154",3.90mm 宽)
供应商设备封装: 16-SOIC
包装: 带卷 (TR)
HIP4082
Dual-In-Line Plastic Packages (PDIP)
INDEX
AREA
N
1 2 3
N/2
E1
E16.3 (JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
INCHES MILLIMETERS
-B-
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-A-
BASE
PLANE
SEATING
PLANE
D1
B1
B
D
D1
e
0.010 (0.25) M
A2
-C-
L
A1
e C
C A B S
E
CL
e A
C
e B
A
A1
A2
B
B1
C
D
D1
-
0.015
0.115
0.014
0.045
0.008
0.735
0.005
0.210
-
0.195
0.022
0.070
0.014
0.775
-
-
0.39
2.93
0.356
1.15
0.204
18.66
0.13
5.33
-
4.95
0.558
1.77
0.355
19.68
-
4
4
-
-
8, 10
-
5
5
NOTES:
E
0.300
0.325
7.62
8.25
6
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
E1
e
e A
0.240 0.280
0.100 BSC
0.300 BSC
6.10 7.11
2.54 BSC
7.62 BSC
5
-
6
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in JE-
DEC seating plane gauge GS - 3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
e B
L
N
-
0.115
16
0.430
0.150
-
2.93
16
10.92
3.81
7
4
9
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and e A are measured with the leads constrained to be perpendic-
ular to datum -C- .
7. e B and e C are measured at the lead tips with the leads unconstrained.
e C must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
11
Rev. 0 12/93
FN3676.4
January 3, 2006
相关PDF资料
PDF描述
GMC05DRYN-S734 CONN EDGECARD 10POS DIP .100 SLD
395-050-541-801 CARD EDGE 50POS DL .100X.200 BLK
GEC17DRYN-S734 CONN EDGECARD 34POS DIP .100 SLD
395-050-541-204 CARD EDGE 50POS DL .100X.200 BLK
GSC05DRYH-S734 CONN EDGECARD 10POS DIP .100 SLD
相关代理商/技术参数
参数描述
HIP4082IBTS2457 制造商:Intersil Corporation 功能描述:
HIP4082IBZ 功能描述:功率驱动器IC 80V H BRDG FET DRVR RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube
HIP4082IBZ 制造商:Intersil Corporation 功能描述:IC MOSFET DRIVER QUAD
HIP4082IBZ 制造商:Intersil Corporation 功能描述:MOSFET Driver IC
HIP4082IBZT 功能描述:功率驱动器IC TAPE & VER OF STDARD HIP4082IB RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube