参数资料
型号: HIP4082IP
厂商: Intersil
文件页数: 11/12页
文件大小: 0K
描述: IC DRIVER H-BRIDGE 16-DIP
标准包装: 25
配置: 半桥
输入类型: 非反相
延迟时间: 75ns
电流 - 峰: 1.4A
配置数: 1
输出数: 4
高端电压 - 最大(自引导启动): 95V
电源电压: 8.5 V ~ 15 V
工作温度: -55°C ~ 125°C
安装类型: 通孔
封装/外壳: 16-DIP(0.300",7.62mm)
供应商设备封装: 16-PDIP
包装: 管件
产品目录页面: 1239 (CN2011-ZH PDF)
HIP4082
Dual-In-Line Plastic Packages (PDIP)
INDEX
AREA
N
1 2 3
N/2
E1
E16.3 (JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
INCHES MILLIMETERS
-B-
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-A-
BASE
PLANE
SEATING
PLANE
D1
B1
B
D
D1
e
0.010 (0.25) M
A2
-C-
L
A1
e C
C A B S
E
CL
e A
C
e B
A
A1
A2
B
B1
C
D
D1
-
0.015
0.115
0.014
0.045
0.008
0.735
0.005
0.210
-
0.195
0.022
0.070
0.014
0.775
-
-
0.39
2.93
0.356
1.15
0.204
18.66
0.13
5.33
-
4.95
0.558
1.77
0.355
19.68
-
4
4
-
-
8, 10
-
5
5
NOTES:
E
0.300
0.325
7.62
8.25
6
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
E1
e
e A
0.240 0.280
0.100 BSC
0.300 BSC
6.10 7.11
2.54 BSC
7.62 BSC
5
-
6
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in JE-
DEC seating plane gauge GS - 3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
e B
L
N
-
0.115
16
0.430
0.150
-
2.93
16
10.92
3.81
7
4
9
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and e A are measured with the leads constrained to be perpendic-
ular to datum -C- .
7. e B and e C are measured at the lead tips with the leads unconstrained.
e C must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
11
Rev. 0 12/93
FN3676.4
January 3, 2006
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