参数资料
| 型号： | HIP6006CV |
| 厂商： | Intersil |
| 文件页数： | 6/12页 |
| 文件大小： | 0K |
| 描述： | IC CTRLR PWM VOLT MODE 14-TSSOP |
| 标准包装： | 96 |
| 应用： | 控制器，Intel Pentium? Pro、PowerP、Alpha |
| 输入电压： | 5V，12V |
| 输出数： | 1 |
| 输出电压： | 1.3 V ~ 12 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | * |
| 封装/外壳： | 14-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | * |
| 包装： | 管件 |
HIP6006
complete its cycle. Figure 4 shows this operation with an
overload condition. Note that the inductor current increases
to over 15A during the C SS charging interval and causes an
over-current trip. The converter dissipates very little power
with this method. The measured input power for the
HIP6006
V IN
conditions of Figure 4 is 2.5W.
The over-current function will trip at a peak inductor current
UGATE
PHASE
Q1
L O
V OUT
I PEAK = ---------------------------------------------------
(I PEAK) determined by:
I OCSET ? R OCSET
r DS ( ON )
LGATE
PGND
Q2
D2
C IN
C O
3. Determine I PEAK for I PEAK > I OUT ( MAX ) + ( ? I ) ? 2
+V IN
L O
C BOOT
HIP6006
where I OCSET is the internal OCSET current source (200 μ A
- typical). The OC trip point varies mainly due to the
MOSFETs r DS(ON) variations. To avoid over-current tripping
in the normal operating load range, find the R OCSET resistor
from the equation above with:
1. The maximum r DS(ON) at the highest junction
temperature.
2. The minimum I OCSET from the specification table.
,
where ? I is the output inductor ripple current.
For an equation for the ripple current see the section under
component guidelines titled ‘Output Inductor Selection’.
A small ceramic capacitor should be placed in parallel with
RETURN
FIGURE 5. PRINTED CIRCUIT BOARD POWER AND
GROUND PLANES OR ISLANDS
current paths on the SS PIN and locate the capacitor, C ss
close to the SS pin because the internal current source is
only 10 μ A. Provide local V CC decoupling between VCC and
GND pins. Locate the capacitor, C BOOT as close as practical
to the BOOT and PHASE pins.
BOOT
D1
Q1
V OUT
PHASE
R OCSET to smooth the voltage across R OCSET in the
presence of switching noise on the input voltage.
SS
+12V
Q2
C O
VCC
Application Guidelines
Layout Considerations
As in any high frequency switching converter, layout is very
C SS
GND
C VCC
important. Switching current from one power device to
another can generate voltage transients across the
impedances of the interconnecting bond wires and circuit
traces. These interconnecting impedances should be
minimized by using wide, short printed circuit traces. The
critical components should be located as close together as
possible using ground plane construction or single point
grounding.
Figure 5 shows the critical power components of the
converter. To minimize the voltage overshoot the
interconnecting wires indicated by heavy lines should be part
of ground or power plane in a printed circuit board. The
components shown in Figure 6 should be located as close
together as possible. Please note that the capacitors C IN
and C O each represent numerous physical capacitors.
Locate the HIP6006 within 3 inches of the MOSFETs, Q1
and Q2. The circuit traces for the MOSFETs’ gate and
source connections from the HIP6006 must be sized to
handle up to 1A peak current.
Figure 6 shows the circuit traces that require additional
layout consideration. Use single point and ground plane
construction for the circuits shown. Minimize any leakage
6
FIGURE 6. PRINTED CIRCUIT BOARD SMALL SIGNAL
LAYOUT GUIDELINES
Feedback Compensation
Figure 7 highlights the voltage-mode control loop for a
synchronous-rectified buck converter. The output voltage
(Vout) is regulated to the Reference voltage level. The error
amplifier (Error Amp) output (V E/A ) is compared with the
oscillator (OSC) triangular wave to provide a pulse-width
modulated (PWM) wave with an amplitude of V IN at the
PHASE node. The PWM wave is smoothed by the output filter
(L O and C O ).
The modulator transfer function is the small-signal transfer
function of Vout/V E/A . This function is dominated by a DC
Gain and the output filter (L O and C O ), with a double pole
break frequency at F LC and a zero at F ESR . The DC Gain of
the modulator is simply the input voltage (V IN ) divided by the
peak-to-peak oscillator voltage ? V OSC .
相关PDF资料 |
PDF描述 |
|---|---|
| HIP6006CB | IC CTRLR PWM VOLTAGE MODE 14SOIC |
| UWZ0J152MCL1GS | CAP ALUM 1500UF 6.3V 20% SMD |
| HIP6004ECV | IC CTRLR PWM VOLTAGE MON 20TSSOP |
| HIP6004BCB | IC CTRLR PWM VOLTAGE MON 20-SOIC |
| UVK2V3R3MPD | CAP ALUM 3.3UF 350V 20% RADIAL |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HIP6006CV-T | 功能描述:IC CTRLR PWM VOLT MODE 14-TSSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,000 系列:- 应用:电源，ICERA E400，E450 输入电压:4.1 V ~ 5.5 V 输出数:10 输出电压:可编程 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:42-WFBGA，WLCSP 供应商设备封装:42-WLP 包装:带卷 (TR) |
| HIP6006CV-TS2462 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HIP6006EVAL1 | 功能描述:电源管理IC开发工具 SYNC BUCK EVAL BRD RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| HIP6007 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Buck Pulse-Width Modulator (PWM) Controller |
| HIP6007CB | 功能描述:IC CTRLR PWM STD BUCK 14-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,000 系列:- 应用:电源，ICERA E400，E450 输入电压:4.1 V ~ 5.5 V 输出数:10 输出电压:可编程 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:42-WFBGA，WLCSP 供应商设备封装:42-WLP 包装:带卷 (TR) |
发布紧急采购，3分钟左右您将得到回复。