参数资料
型号: HIP6501A
厂商: Intersil Corporation
元件分类: 基准电压源/电流源
英文描述: Triple Linear Power Controller with ACPI Control Interface(带ACPI控制接口的线性电源控制器)
中文描述: 三线性电源控制器ACPI控制接口(带ACPI的控制接口的线性电源控制器)
文件页数: 14/14页
文件大小: 140K
代理商: HIP6501A
14
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
HIP6501A
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension“E”doesnotincludeinterleadflashorprotrusions.Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Theleadwidth“B”,asmeasured0.36mm(0.014inch)orgreaterabove
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
0.25(0.010)
B
M
M
α
M16.15
(JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3859
0.3937
9.80
10.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
α
16
16
7
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
相关PDF资料
PDF描述
HIP6501EVAL1 Triple Linear Power Controller with ACPI Control Interface
HIP6501ACB Triple Linear Power Controller with ACPI Control Interface
HIP6521 PWM and Triple Linear Power Controller
HIP6521CB PWM and Triple Linear Power Controller
HIP6521EVAL1 PWM and Triple Linear Power Controller
相关代理商/技术参数
参数描述
HIP6501A_04 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Triple Linear Power Controller with ACPI Control Interface
HIP6501ACB 功能描述:IC PWM TRIPLE POWER CTRLR 16SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 电源控制器,监视器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 应用:多相控制器 输入电压:- 电源电压:9 V ~ 14 V 电流 - 电源:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP(5x5) 包装:带卷 (TR)
HIP6501ACB-T 功能描述:IC PWM TRIPLE POWER CTRLR 16SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 电源控制器,监视器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 应用:多相控制器 输入电压:- 电源电压:9 V ~ 14 V 电流 - 电源:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP(5x5) 包装:带卷 (TR)
HIP6501ACBZ 功能描述:PMIC 解决方案 COMPANION CHIP TO HI6020/21 RoHS:否 制造商:Texas Instruments 安装风格:SMD/SMT 封装 / 箱体:QFN-24 封装:Reel
HIP6501ACBZ-T 功能描述:PMIC 解决方案 COMPANION CHIP TO HIP60/21 TAPE/REEL RoHS:否 制造商:Texas Instruments 安装风格:SMD/SMT 封装 / 箱体:QFN-24 封装:Reel