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参数资料
| 型号： | HIP6602BCRZ-T |
| 厂商： | Intersil |
| 文件页数： | 8/12页 |
| 文件大小： | 0K |
| 描述： | IC DRVR MOSF 2CH SYC BUCK 16-QFN |
| 标准包装： | 6,000 |
| 配置： | 高端和低端，同步 |
| 输入类型： | PWM |
| 电流 - 峰： | 400mA |
| 配置数： | 2 |
| 输出数： | 4 |
| 高端电压 - 最大（自引导启动）： | 15V |
| 电源电压： | 10.8 V ~ 13.2 V |
| 工作温度： | 0°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VQFN 裸露焊盘 |
| 供应商设备封装： | 16-QFN-EP（5x5） |
| 包装： | 带卷 (TR) |
HIP6602B
P = 1.05 x f SW x V PVCC [ 3 _ (Q U1 + Q U2 ) + (Q L1 + Q L2 ) ] + I DDQ x VCC
+12V
ensure safe operation at the desired frequency for the
selected MOSFETs. The total chip power dissipation is
approximated as:
2
where f sw is the switching frequency of the PWM signal. Q U
and Q L is the upper and lower gate charge determined by
MOSFET selection and any external capacitance added to
the gate pins. The I DDQ VCC product is the quiescent power
of the driver and is typically 40mW.
The 1.05 term is a correction factor derived from the
following characterization. The base circuit for characterizing
the drivers for different loading profiles and frequencies is
provided. C U and C L are the upper and lower gate load
capacitors. Decoupling capacitors [0.15μF] are added to the
PVCC and VCC pins. The bootstrap capacitor value in the
test circuit is 0.01μF.
The power dissipation approximation is a result of power
In Figure 2, C U and C L values are the same and frequency
is varied from 10kHz to 1.5MHz. PVCC and VCC are tied
together to a +12V supply.
Figure 3 shows the dissipation in the driver with 1nF loading
on both gates and each individually. Figure 4 is the same as
Figure 3 except the capacitance is increased to 3nF.
The impact of loading on power dissipation is shown in
Figure 5. Frequency is held constant while the gate
capacitors are varied from 1nF to 5nF. VCC and PVCC are
tied together and to a +12V supply. Figures 6, 7 and 8 show
the same characterization for PVCC tied to +5V instead of
+12V. The gate supply voltage, PVCC, within the HIP6602B
sets both upper and lower gate driver supplies at the same
5V level for the last three curves.
Test Circuit
+5V OR +12V
+5V OR +12V
0.01μF
transferred to and from the upper and lower gates. But, the
internal bootstrap device also dissipates power on-chip
during the refresh cycle. Expressing this power in terms of
the upper MOSFET total gate charge is explained below.
The bootstrap device conducts when the lower MOSFET or
PVCC
0.15μF
VCC
BOOT1
UGATE1
PHASE1
2N7002
C U
its body diode conducts and pulls the PHASE node toward
GND. While the bootstrap device conducts, a current path is
formed that refreshes the bootstrap capacitor. Since the
upper gate is driving a MOSFET, the charge removed from
the bootstrap capacitor is equivalent to the total gate charge
of the MOSFET. Therefore, the refresh power required by
the bootstrap capacitor is equivalent to the power used to
charge the gate capacitance of the upper MOSFETs.
0.15μF
PWM1
PGND
GND
LGATE1
2N7002
C L
0.01μF
BOOT2
UGATE2
100k ?
2N7002
P REFRESH = f SW Q
V
LOSS PVCC
= f SW Q U V PVCC
PWM2
PHASE2
C U
where Q LOSS is the total charge removed from the bootstrap
capacitors and provided to the upper gate loads.
LGATE2
2N7002
100k ?
C L
FIGURE 1. HIP6602B TEST CIRCUIT
8
FN9076.5
July 22, 2005
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HIP6602CB | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HIP6602CB-T | 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel |
| HIP6603 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Synchronous-Rectified Buck MOSFET Drivers |
| HIP6603A | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Synchronous Rectified Buck MOSFET Drivers |
| HIP6603ACB | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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