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参数资料
| 型号： | HIP6603BECBZ-T |
| 厂商： | Intersil |
| 文件页数： | 2/12页 |
| 文件大小： | 0K |
| 描述： | IC DRIVER MOSF SYNC BUCK 8EPSOIC |
| 标准包装： | 2,500 |
| 配置： | 高端和低端，同步 |
| 输入类型： | PWM |
| 电流 - 峰： | 400mA |
| 配置数： | 1 |
| 输出数： | 2 |
| 高端电压 - 最大（自引导启动）： | 15V |
| 电源电压： | 10.8 V ~ 13.2 V |
| 工作温度： | 0°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm Width）裸露焊盘 |
| 供应商设备封装： | 8-SOIC-EP |
| 包装： | 带卷 (TR) |
HIP6601B, HIP6603B, HIP6604B
Ordering Information
TEMP.
Pinouts
HIP6601BCB, HIP6603BCB,
HIP6601BECB, HIP6603BECB,
PART NUMBER
(Notes 1, 2)
PART
MARKING
RANGE
(°C)
PACKAGE
(Pb-free)
PKG.
DWG. #
(8 LD SOIC, EPSOIC)
TOP VIEW
HIP6601BCBZ*
6601 BCBZ
0 to +85
8 Ld SOIC
M8.15
UGATE
1
8
PHASE
HIP6601BCBZA*
6601 BCBZ
0 to +85
8 Ld SOIC
M8.15
HIP6601BECBZ*
6601 BECBZ
0 to +85
8 Ld EPSOIC M8.15B
BOOT
2
7
PVCC
HIP6601BECBZA* 6601 BECBZ
0 to +85
8 Ld EPSOIC M8.15B
PWM
3
6
VCC
HIP6603BCBZ*
6603 BCBZ
0 to +85
8 Ld SOIC
M8.15
GND
4
5
LGATE
HIP6603BECBZ*
6603 BECBZ
0 to +85
8 Ld EPSOIC M8.15B
HIP6604B
HIP6604BCRZ*
66 04BCRZ
0 to +85
16 Ld QFN
L16.4x4
(16 LD QFN)
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on
reel specifications.
NOTES:
TOP VIEW
1. These Intersil Pb-free plastic packaged products employ special Pb-free
material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and
NC 1
16
15
14
13
12 NC
compatible with both SnPb and Pb-free soldering operations). Intersil Pb-
free products are MSL classified at Pb-free peak reflow temperatures that
BOOT 2
11
PVCC
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. For Moisture Sensitivity Level (MSL), please see device information
PWM 3
10 LVCC
page for HIP6601B , HIP6603B , HIP6604B . For more information
GND 4
9
VCC
on MSL, please see Technical Brief TB363 .
5
6
7
8
Block Diagrams
HIP6601B AND HIP6603B
PVCC
VCC
+5V
BOOT
UGATE
? VCC FOR HIP6601B
10k
SHOOT-
THROUGH
PHASE
PVCC FOR HIP6603B
PWM
10k
CONTROL
LOGIC
PROTECTION
?
LGATE
GND
PVCC
VCC
+5V
PAD
SHOOT-
FOR HIP6601BECB AND HIP6603BECB DEVICES, THE PAD ON THE BOTTOM
SIDE OF THE PACKAGE MUST BE SOLDERED TO THE PC BOARD.
HIP6604B QFN PACKAGE
BOOT
UGATE
PHASE
10k
THROUGH
PWM
CONTROL
PROTECTION
LVCC
CONNECT LVCC TO VCC FOR HIP6601B CONFIGURATION
CONNECT LVCC TO PVCC FOR HIP6603B CONFIGURATION.
GND
10k
LOGIC
2
PAD
LGATE
PGND
PAD ON THE BOTTOM SIDE OF THE PACKAGE MUST BE SOLDERED TO THE PC BOARD
FN9072.8
May 1, 2012
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HIP6603CB | 制造商:Rochester Electronics LLC 功能描述:SYNCHRONUS-FET DRIVER,12V/5V DRIVE - Bulk |
| HIP6603ECB | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Synchronous Rectified Buck MOSFET Drivers |
| HIP6603ECB-T | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Synchronous Rectified Buck MOSFET Drivers |
| HIP6604 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Synchronous Rectified Buck MOSFET Drivers |
| HIP6604B | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Synchronous Rectified Buck MOSFET Drivers |
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