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参数资料
| 型号： | HIR7373C |
| 厂商： | Everlight Electronics Co Ltd |
| 文件页数： | 7/8页 |
| 文件大小： | 0K |
| 描述： | LED IR 5MM GAA1AS WATER CLR TH |
| 标准包装： | 500 |
| 电流 - DC 正向(If)： | 100mA |
| 辐射强度(le)最小值@正向电流： | 15mW/sr @ 20mA |
| 波长： | 850nm |
| 正向电压： | 1.45V |
| 视角： | 40° |
| 方向： | 顶视图 |
| 安装类型： | 通孔 |
| 封装/外壳： | 径向 |
| 包装： | 散装 |
| 其它名称： | 1080-1032 |
DATASHEET
5.0mm Infrared LED
HIR7373C
1.
Lead Forming
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During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it
may break the LEDs.
Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs
are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.
2.
Storage
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The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits
are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a
nitrogen atmosphere and moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can
occur.
3.
Soldering
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Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb,
and soldering beyond the base of the tie bar is recommended.
Recommended soldering conditions:
Hand Soldering
DIP Soldering
Temp. at tip of iron
Soldering time
Distance
300 ℃ Max. (30W Max.)
3 sec Max.
3mm Min.(From solder
joint to epoxy bulb)
Preheat temp.
Bath temp. & time
Distance
100 ℃ Max. (60 sec Max.)
260 Max., 5 sec Max
3mm Min. (From solder
joint to epoxy bulb)
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Recommended soldering profile
laminar wave
Fluxing
Prehead
Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.
Dip and hand soldering should not be done more than one time
7
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Revision Copyright ?
LifecyclePhase:
Release
2010, Everlight All Rights Reserved. Release Date : Mar.29.2013. Issue No:DIR-0000949 Date:2013-06-04 10:06:47.0
Expired Period: Forever
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HIR7393C | 功能描述:红外发射源 Infrared LED RoHS:否 制造商:Fairchild Semiconductor 波长:880 nm 射束角:+/- 25 辐射强度: 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:Side Looker 封装:Bulk |
| HIR83-01B/TR8 | 制造商:Everlight Electronics Co 功能描述:HIR83 Series 65 mA 5 mW/sr 1.4 V 850 nm SMT Infrared LED 1.6 0.8 mm 制造商:Everlight Electronics Co 功能描述:HIR83 Series 65 mA 5 mW/sr 1.4 V 850 nm SMT Infrared LED 1.6 ? 0.8 mm |
| HIR83-01B-TR8 | 制造商:EVERLIGHT 制造商全称:Everlight Electronics Co., Ltd 功能描述:1.6×0.8mm Package Infrared LED |
| HIR8323 | 制造商:EVERLIGHT 制造商全称:Everlight Electronics Co., Ltd 功能描述:5mm Infrared LED, T-1 3/4 |
| HIR8323/C16 | 功能描述:红外发射源 Infrared LED RoHS:否 制造商:Fairchild Semiconductor 波长:880 nm 射束角:+/- 25 辐射强度: 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:Side Looker 封装:Bulk |
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