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参数资料
| 型号： | HK1005R27J-T |
| 厂商： | Taiyo Yuden |
| 文件页数： | 28/31页 |
| 文件大小： | 0K |
| 描述： | INDUCTOR HI FREQ 270NH 5% 0402 |
| 产品目录绘图： | HK1005 Series Side HK1005 Series Top |
| 标准包装： | 1 |
| 系列： | HK |
| 电感： | 270nH |
| 电流： | 200mA |
| 类型： | 陶瓷 |
| 容差： | ±5% |
| 屏蔽： | 无屏蔽 |
| DC 电阻(DCR)： | 最大 4.8 欧姆 |
| Q因子@频率： | 8 @ 100MHz |
| 频率 - 自谐振： | 400MHz |
| 封装/外壳： | 0402（1005 公制） |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 工作温度： | -55°C ~ 85°C |
| 频率 - 测试： | 100MHz |
| 产品目录页面： | 1821 (CN2011-ZH PDF) |
| 其它名称： | 587-1791-6 |
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Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when
designing land-patterns.
c
d
c
Recommended land dimension for Reflow-soldering
Type
3216
2010
1210
0806
0605
Size
L 3.2 2.0 1.25 0.85 0.65
W 1.6 1.0 1.0 0.65 0.50
a 0.7～0.9 0.5～0.6
0.45～0.55 0.25～0.35 0.27～0.33
d
b 0.8～1.0
0.5～0.6
0.7～0.8
0.25～0.35 0.17～0.23
（（2） Examples of good and bad solder application
c 0.4～0.5
d 0.8
（Unit：mm）
0.2～0.3
0.5
0.25～0.35 0.25～0.35 0.20～0.26
0.55 0.5 0.4
Item
Not recommended
Lead wire of component
Recommended
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Component placement close to
the chassis
Solder (for grounding)
Electrode pattern
Lead wire of component
Solder-resist
Hand-soldering of leaded
Soldering iron
Solder-resist
components near mounted
components
Solder-resist
Horizontal component
placement
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical
stresses from board warp or deflection.
Item
Deflection of the board
Not recommended
Recommended
Position the component at a
right angle to the direction of
the mechanical stresses that
are anticipated.
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary
depending on inductor layout.
An example below should be counted for better design.
E
D
Perforation
C
A
Slit
B
Magnitude of stress
A＞B＝C＞D＞E
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the
method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E02R01
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HK1005XXXX | 制造商:TAIYO-YUDEN 制造商全称:Taiyo Yuden (U.S.A.), Inc 功能描述:MULTILAYER CHIP INDUCTOR FOR HIGH FREQUENCY HK SERIES |
| HK100A-12 | 制造商:TDK 功能描述:Power Supplies, AC/DC Converters |
| HK100A12/A | 制造商:TDK-Lambda Corporation 功能描述:AC/DC Power Supply Single-OUT 12V 8.5A 制造商:TDK-Lambda 功能描述:AC/DC Power Supply Single-OUT 12V 8.5A |
| HK100A-12/A | 功能描述:线性和开关式电源 12V 8.5A RoHS:否 制造商:TDK-Lambda 产品:Switching Supplies 开放式框架/封闭式:Enclosed 输出功率额定值:800 W 输入电压:85 VAC to 265 VAC 输出端数量:1 输出电压（通道 1）:20 V 输出电流（通道 1）:40 A 商用/医用: 输出电压（通道 2）: 输出电流（通道 2）: 安装风格:Rack 长度: 宽度: 高度: |
| HK100A15 | 制造商:TDK-Lambda Corporation 功能描述:100W Power Supply - 85-132V in - 15V 7A out |
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