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参数资料
| 型号： | HK1608R47J-T |
| 厂商： | Taiyo Yuden |
| 文件页数： | 27/31页 |
| 文件大小： | 0K |
| 描述： | INDUCTOR HI FREQ 470NH 5% 0603 |
| 产品目录绘图： | HK1608 Series Top HK1608 Series Side |
| 标准包装： | 1 |
| 系列： | HK |
| 电感： | 470nH |
| 电流： | 150mA |
| 类型： | 陶瓷 |
| 容差： | ±5% |
| 屏蔽： | 无屏蔽 |
| DC 电阻(DCR)： | 最大 2.6 欧姆 |
| Q因子@频率： | 8 @ 50MHz |
| 频率 - 自谐振： | 300MHz |
| 封装/外壳： | 0603（1608 公制） |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 工作温度： | -40°C ~ 85°C |
| 频率 - 测试： | 50MHz |
| 产品目录页面： | 1822 (CN2011-ZH PDF) |
| 其它名称： | 587-1565-6 |
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Precautions on the use of Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
■ PRECAUTIONS
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social
ramifications.
Precautions
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly
differentiated from components used in general purpose applications.
◆Operating Current（Verification of Rated current）
1. The operating current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
2. PCB Design
◆Pattern configurations（Design of Land-patterns）
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor
performance.
Therefore, the following items must be carefully considered in the design of solder land patterns:
（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or
cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder
pads which in turn determines the amount of solder necessary to form the fillets.
Precautions
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's
soldering point is separated by solder-resist.
（3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to
design land patterns smaller than terminal electrode of chips.
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing
processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered
boards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to
minimize stress.
◆Pattern configurations（Design of Land-patterns）
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets
which extend above the component end terminations）. Examples of improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
Land pattern
C
Chip inductor
Solder-resist
Chip inductor
W
B
A
B
L
Recommended land dimensions for wave-soldering
（Unit：mm）
Type
1608
2012
2125
2016
2520
3216
Technical
considerations
Size
L 1.6 2.0 2.0
W 0.8 1.25 1.25
A 0.8～1.0 1.0～1.4 1.0～1.4
B 0.5～0.8 0.8～1.5 0.8～1.5
C 0.6～0.8 0.9～1.2 0.9～1.2
2.0 2.5
1.6 2.0
1.0～1.4 1.0～1.4
0.8～1.5 0.6～1.0
1.3～1.6 1.6～2.0
3.2
1.6
1.8～2.5
0.8～1.7
1.2～1.6
Recommended land dimensions for reflow-soldering
（Unit：mm）
Type
0402
0603
1005
105
1608
2012
Size
L 0.4 0.6 1.0
W 0.2 0.3 0.5
A 0.15～0.25 0.20～0.30 0.45～0.55
B 0.10～0.20 0.20～0.30 0.40～0.50
C 0.15～0.30 0.25～0.40 0.45～0.55
1.0
0.6
0.50～0.55
0.30～0.40
0.60～0.70
1.6
0.8
0.8～1.0
0.6～0.8
0.6～0.8
2.0
1.25
0.8～1.2
0.8～1.2
0.9～1.6
Type
2125
2016
2520
3216
Size
A
B
C
L
W
2.0
1.25
0.8～1.2
0.8～1.2
0.9～1.6
2.0
1.6
0.8～1.2
0.8～1.2
1.2～2.0
2.5
2.0
1.0～1.4
0.6～1.0
1.8～2.2
3.2
1.6
1.8～2.5
0.6～1.5
1.2～2.0
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HK1608R47J-T | 制造商:TAIYO YUDEN 功能描述:MULTI-LAYER SMD INDUCTOR |
| HK-1608-R47JTK | 功能描述:固定电感器 470nH 150mA 5% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| HK1608R47J-TV | 功能描述:470nH Unshielded Multilayer Inductor 110mA 2.6 Ohm Max 0603 (1608 Metric) 制造商:taiyo yuden 系列:HK 包装:剪切带（CT） 零件状态:过期 类型:多层 材料 - 磁芯:铁氧体 电感:470nH 容差:±5% 额定电流:110mA 电流 - 饱和值:- 屏蔽:无屏蔽 DC 电阻（DCR）:2.6 欧姆最大 不同频率时的 Q 值:8 @ 50MHz 频率 - 自谐振:300MHz 等级:AEC-Q200 工作温度:-40°C ~ 125°C 频率 - 测试:50MHz 安装类型:表面贴装 封装/外壳:0603（1608 公制） 大小/尺寸:0.063" 长 x 0.031" 宽（1.60mm x 0.80mm） 高度 - 安装（最大值）:0.037"（0.95mm） 标准包装:1 |
| HK-1608-RI0JTK | 制造商:KEMET 制造商全称:Kemet Corporation 功能描述:Surface Mount Ferrite Products |
| HK-1608-RI8JTK | 制造商:KEMET 制造商全称:Kemet Corporation 功能描述:Surface Mount Ferrite Products |
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